The present invention relates to a resin solution composition containing at least one resin selected from the group consisting of aromatic polysulfones, aromatic polyamideimides, aromatic polyetherimides, aromatic polyimides and aromatic polyamic acids, a sulfone-based solvent, and an ester-based solvent, wherein in this resin solution composition, an amount of the resin, relative to the total mass of the resin solution composition, is at least 10% by mass but not more than 50% by mass, and an amount of the ester-based solvent, relative to the total amount of the sulfone-based solvent and the ester-based solvent, is at least 15% by mass but not more than 85% by mass.

A polymer composition [composition (C)] comprising: (a) a polyarylene ether ketone (PAEK-1) comprising recurring units deriving from the incorporation of 1,4:3,6-dianhydrohexitols; (b) a poly(biphenyl ether) sulfone (PPSU-1) comprising repeating units of formula (I) and/or (c) a polyetherimide (PEI-1) comprising repeating units of formula (II) wherein Ar* and Ar* are as defined in the specification are herein disclosed. (PAEK-1) and (PPSU-1) and/or (PEI-1) are completely miscible and give rise to compositions that are transparent and possess high strength and stiffness and that are suitable for the manufacture of a variety of shaped articles. ##STR00001##

A polymer composition [composition (C)] comprising: (a) a polyarylene ether ketone (PAEK-1) comprising recurring units deriving from the incorporation of 1,4:3,6-dianhydrohexitols; (b) a poly(biphenyl ether) sulfone (PPSU-1) comprising repeating units of formula (I) and/or (c) a polyetherimide (PEI-1) comprising repeating units of formula (II) wherein Ar* and Ar* are as defined in the specification are herein disclosed. (PAEK-1) and (PPSU-1) and/or (PEI-1) are completely miscible and give rise to compositions that are transparent and possess high strength and stiffness and that are suitable for the manufacture of a variety of shaped articles. ##STR00001##

A resin film having an aromatic polysulfone as a forming material is provided. The resin film has a thickness of less than 100 m, and further contains an organic compound having a boiling point no lower than 250 C. and no higher than 400 C. The organic compound is contained in an amount of at least 500 ppm and at most 4000 ppm relative to the mass of the aromatic polysulfone.

A resin film having an aromatic polysulfone as a forming material is provided. The resin film has a thickness of less than 100 m, and further contains an organic compound having a boiling point no lower than 250 C. and no higher than 400 C. The organic compound is contained in an amount of at least 500 ppm and at most 4000 ppm relative to the mass of the aromatic polysulfone.

Described herein is a process for making a multilayer article comprising forming a first fluoropolymer layer in the absence of liquids by delivering particles from at least one gaseous fluid jet to a metal surface to impregnate the metal surface with a fluoropolymer to form a first fluoropolymer layer, wherein the particles comprise an abrasive particle, a binder, and a first fluoropolymer; coating the first fluoropolymer layer with a second fluoropolymer to form a second fluoropolymer layer and thereby forming a multilayered article; and sintering the multilayered article to form the release surface coated substrate.

Described herein is a process for making a multilayer article comprising forming a first fluoropolymer layer in the absence of liquids by delivering particles from at least one gaseous fluid jet to a metal surface to impregnate the metal surface with a fluoropolymer to form a first fluoropolymer layer, wherein the particles comprise an abrasive particle, a binder, and a first fluoropolymer; coating the first fluoropolymer layer with a second fluoropolymer to form a second fluoropolymer layer and thereby forming a multilayered article; and sintering the multilayered article to form the release surface coated substrate.

A radiation curable composition for preparing a polymeric membrane includes a) a membrane polymer selected from the group consisting of a polysulfone (PSU), a polyether sulfone (PES), a polyether etherketone (PEEK), a polyvinylchloride (PVC), a polyacrylonitrile (PAN), a polyvinylidene fluoride (PVDF), a polyimide (PI), a polyamide (PA) and copolymers thereof; b) a hydrophobic monomer or oligomer having at least two free radical polymerizable groups independently selected from the group consisting of an acrylate group, a methacrylate group, an acrylamide group, a methacrylamide group, a styrene group, a vinyl ether group, a vinyl ester group, a maleate group, a fumarate group, an itaconate group, and a maleimide group; and c) an organic solvent for the membrane polymer and the hydrophobic monomer. A polymeric membrane and a method for manufacturing the membrane are also disclosed.

A radiation curable composition for preparing a polymeric membrane includes a) a membrane polymer selected from the group consisting of a polysulfone (PSU), a polyether sulfone (PES), a polyether etherketone (PEEK), a polyvinylchloride (PVC), a polyacrylonitrile (PAN), a polyvinylidene fluoride (PVDF), a polyimide (PI), a polyamide (PA) and copolymers thereof; b) a hydrophobic monomer or oligomer having at least two free radical polymerizable groups independently selected from the group consisting of an acrylate group, a methacrylate group, an acrylamide group, a methacrylamide group, a styrene group, a vinyl ether group, a vinyl ester group, a maleate group, a fumarate group, an itaconate group, and a maleimide group; and c) an organic solvent for the membrane polymer and the hydrophobic monomer. A polymeric membrane and a method for manufacturing the membrane are also disclosed.

The invention provides a composition that can provide a film exhibiting excellent adhesion to a substrate and having excellent non-stickiness. The composition contains a fluororesin, a heat-resistant resin, water, and a solvent having a boiling point of 205 C. or higher.