C09D183/14

SEALANT COMPOSITION
20230094559 · 2023-03-30 ·

A one-part low modulus room temperature vulcamsable (RTV) silicone composition comprising a titanate and/or zirconate catalyst which cures to a low modulus silicone elastomer which has a good adhesion profile and may be used as a non-staining (clean) sealant having high movement capability which compositions contains an aminosilane adhesion promoter having two hydroxyl or hydrolysable groups per molecule in an amount of 0.1-3.75% by weight of the composition.

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

Exemplary methods of forming a silicon-and-carbon-containing material may include flowing a silicon-and-carbon-containing precursor into a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region of the semiconductor processing chamber. The methods may include forming a plasma within the processing region of the silicon-and-carbon-containing precursor. The plasma may be formed at a frequency above 15 MHz. The methods may include depositing a silicon-and-carbon-containing material on the substrate. The silicon-and-carbon-containing material as-deposited may be characterized by a dielectric constant below or about 3.0.

Hard coating film having multilayer-structure, and polyimide film comprising same

The present invention relates to a hard coating film having a multilayer-structure and, specifically, to a hard coating film having a multilayer-structure, which has a low Vickers hardness (Hv) value while having an excellent scratch resistance together with flexibility.

CURABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE

A method of forming a gap filling on a substrate, the substrate having gaps formed therein, comprises: producing a gap filling polycarbosilazane polymer or oligomer by a polymerization of a reaction mixture of carbosilanes with amines; forming a solution containing the gap filling polycarbosilazane polymer or oligomer; and contacting the solution with the substrate via a spin-on coating, spray coating, dip coating, or slit coating technique to fill the gaps in the substrate forming the silicon and carbon containing gap filling, wherein a concentration of the gap filling polycarbosilazane polymer or oligomer in the solution ranges from 1 to 60 wt %.

CURABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE

A method of forming a gap filling on a substrate, the substrate having gaps formed therein, comprises: producing a gap filling polycarbosilazane polymer or oligomer by a polymerization of a reaction mixture of carbosilanes with amines; forming a solution containing the gap filling polycarbosilazane polymer or oligomer; and contacting the solution with the substrate via a spin-on coating, spray coating, dip coating, or slit coating technique to fill the gaps in the substrate forming the silicon and carbon containing gap filling, wherein a concentration of the gap filling polycarbosilazane polymer or oligomer in the solution ranges from 1 to 60 wt %.

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, AND LIGHT EMITTING DEVICE

A photosensitive resin composition containing (A) an acid-crosslinkable group-containing silicone resin, (B) a photo-acid generator, and (C) quantum dot particles. Thus, a photosensitive resin composition is capable of easily forming a film having favorable heat resistance, lithography resolution, and luminous properties; a photosensitive resin film and a photosensitive dry film are obtained by using the photosensitive resin composition; patterning processes use these; and a light emitting device is obtained by using the photosensitive resin composition.

ORGANOPOLYSILOXANE AND COATING COMPOSITION CONTAINING ORGANOPOLYSILOXANE

Disclosed is an organopolysiloxane having a constituent unit represented by a general formula (1), a constituent unit represented by a general formula (2), and a group represented by a general formula (3) that is directly bonded to a silicon atom.

##STR00001## R.sup.1 represents an alkyl group or an aryl group.

##STR00002## R.sup.2 each independently represents an alkyl group or an aryl group, n is each independently 2 or 3, and m is an integer of 5 to 100.


R.sup.3O—  (3) R.sup.3 represents a hydrogen atom, an alkyl group, or an aryl group.

Aqueous pretreatment for bonded joints with increased heat stability
11479676 · 2022-10-25 · ·

An aqueous composition including: a) at least one epoxy silane containing at least one epoxy group and at least one hydrolysable group bound to Si, b) at least one non-ionic wetting agent and either c1) between 0.2 and 2 wt. % of at least one mercapto silane containing at least one mercapto group and at least one hydrolysable group bound to Si, and as many water-soluble acids as required for the pH of resulting composition to be between 1 and 6, on the condition that epoxy silane content amounts to between 0.2 and 1 wt. %, or c2) between 0.1 and 1 wt. % of a water-soluble organotitanate, in relation to entire weight of aqueous composition, and as many water-soluble bases as required for the pH of resulting composition to be between 8 and 14, on the condition that the epoxy silane content amounts to between 0.2 and 0.5 wt. %.

Siloxane polymer compositions and their use

The present invention provides a method for covering a substrate, and includes the following operations: (a) admixing at least four different silane monomers and at least one bi-silane to a first solvent(s) to form a mixture, with the proviso that at least one of the silane monomers or the bi-silane comprises an active group capable of achieving cross-linking to adjacent siloxane polymer chains of the siloxane polymer composition; (b) subjecting the mixture to an acid treatment so that the silane monomers are at least partially hydrolysed, and the hydrolysed silane monomers, the silane monomers and the bi-silane are at least partially polymerized and cross-linked; (c) optionally changing the first solvent to a second solvent; and (d) subjecting the mixture to further cross-linking of the siloxane polymer to achieve a predetermined degree of cross-linking, depositing the siloxane polymer composition on the substrate, and optionally curing the deposited siloxane polymer composition.

Siloxane polymer compositions and their use

The present invention provides a method for covering a substrate, and includes the following operations: (a) admixing at least four different silane monomers and at least one bi-silane to a first solvent(s) to form a mixture, with the proviso that at least one of the silane monomers or the bi-silane comprises an active group capable of achieving cross-linking to adjacent siloxane polymer chains of the siloxane polymer composition; (b) subjecting the mixture to an acid treatment so that the silane monomers are at least partially hydrolysed, and the hydrolysed silane monomers, the silane monomers and the bi-silane are at least partially polymerized and cross-linked; (c) optionally changing the first solvent to a second solvent; and (d) subjecting the mixture to further cross-linking of the siloxane polymer to achieve a predetermined degree of cross-linking, depositing the siloxane polymer composition on the substrate, and optionally curing the deposited siloxane polymer composition.