The object of the present invention is to attain water repellency as well as the heat resistance and the light resistance. the transparent film of the present invention comprises: a polysiloxane backbone; and a trialkylsilyl containing molecular chain bonded to a part of silicon atoms forming the polysiloxane backbone, wherein alkyl groups in the trialkylsilyl containing molecular chain may be replaced by fluoroalkyl groups, and the transparent film satisfies at least one of the relationships of:

(B.sub.H−A.sub.0)/A.sub.0×100(%)≧−27(%); and

(B.sub.L−A.sub.0)/A.sub.0×100(%)≧−15(%), provided that A.sub.0 is an initial contact angle of a liquid droplet on the transparent film, B.sub.H is a contact angle of a liquid droplet on the transparent film incubated at 200° C. for 24 hours, and B.sub.L is a contact angle of a liquid droplet on the transparent film irradiated by a xenon lamp with an intensity of 250 W for 100 hours.

The object of the present invention is to attain water repellency as well as the heat resistance and the light resistance. the transparent film of the present invention comprises: a polysiloxane backbone; and a trialkylsilyl containing molecular chain bonded to a part of silicon atoms forming the polysiloxane backbone, wherein alkyl groups in the trialkylsilyl containing molecular chain may be replaced by fluoroalkyl groups, and the transparent film satisfies at least one of the relationships of:

(B.sub.H−A.sub.0)/A.sub.0×100(%)≧−27(%); and

(B.sub.L−A.sub.0)/A.sub.0×100(%)≧−15(%), provided that A.sub.0 is an initial contact angle of a liquid droplet on the transparent film, B.sub.H is a contact angle of a liquid droplet on the transparent film incubated at 200° C. for 24 hours, and B.sub.L is a contact angle of a liquid droplet on the transparent film irradiated by a xenon lamp with an intensity of 250 W for 100 hours.

The object of the present invention is to attain water repellency as well as the heat resistance and the light resistance. the transparent film of the present invention comprises: a polysiloxane backbone; and a trialkylsilyl containing molecular chain bonded to a part of silicon atoms forming the polysiloxane backbone, wherein alkyl groups in the trialkylsilyl containing molecular chain may be replaced by fluoroalkyl groups, and the transparent film satisfies at least one of the relationships of:

(B.sub.H−A.sub.0)/A.sub.0×100(%)≧−27(%); and

(B.sub.L−A.sub.0)/A.sub.0×100(%)≧−15(%), provided that A.sub.0 is an initial contact angle of a liquid droplet on the transparent film, B.sub.H is a contact angle of a liquid droplet on the transparent film incubated at 200° C. for 24 hours, and B.sub.L is a contact angle of a liquid droplet on the transparent film irradiated by a xenon lamp with an intensity of 250 W for 100 hours.

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

##STR00001##

Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (A) an alkoxysilyl-ethylene group-terminated organopolysiloxane having in each molecule at least one silyl-ethylene bond represented by the following structural formula (1)

##STR00001##

(wherein R.sup.1 represents an alkyl group; R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (B) an organopolysiloxane represented by the following general formula (2)

##STR00002## (wherein R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa.Math.s at 25° C.); and (C) a curing catalyst.

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin-curing agent; and (C) a filler. This can provide a resin composition and a resin film that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection performance, good adhesion properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably. The present invention also provides a method for producing the resin film, a semiconductor device molded with the resin film, and a method for producing the semiconductor device.

##STR00001##

The present invention relates to alkoxyalkylsilane-modified polysiloxanes, to processes for the production thereof, and to the use thereof.

The present invention relates to alkoxyalkylsilane-modified polysiloxanes, to processes for the production thereof, and to the use thereof.

Provided is a manufacturing method for a film containing a condensate of hydrolyzable silane compounds, the manufacturing method including: forming, on a base material, a layer containing a condensate of a hydrolyzable silane compound having an epoxy group and a hydrolyzable silane compound having a fluorine-containing group, and a solvent; and curing the layer, the solvent containing one of ethanol and methanol serving as a first alcohol component, and at least one kind of alcohol having a boiling point of from 90° C. to 200° C. serving as a second alcohol component, the solvent having a content of the second alcohol component of from 2.00 mass % to 60.00 mass %, the condensate having a degree of condensation of from 20% to 80%.

Provided is a manufacturing method for a film containing a condensate of hydrolyzable silane compounds, the manufacturing method including: forming, on a base material, a layer containing a condensate of a hydrolyzable silane compound having an epoxy group and a hydrolyzable silane compound having a fluorine-containing group, and a solvent; and curing the layer, the solvent containing one of ethanol and methanol serving as a first alcohol component, and at least one kind of alcohol having a boiling point of from 90° C. to 200° C. serving as a second alcohol component, the solvent having a content of the second alcohol component of from 2.00 mass % to 60.00 mass %, the condensate having a degree of condensation of from 20% to 80%.