The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.

A lamination method, includes: a first coating step of applying any one of a main agent M and a curing agent H of a two-component curable adhesive as a coating liquid to a first web W1; a second coating step of applying the other one of the main agent M and the curing agent H as a coating liquid to a second web W2; and a bonding step of bonding a coating liquid-coated surface of the first web W1 and a coating liquid-coated surface of the second web W2, and of combining the main agent M and the curing agent H to increase a molecular weight. In addition, in the first coating step and the second coating step, the main agent M or the curing agent H is applied by a gravure coater.

A lamination method, includes: a first coating step of applying any one of a main agent M and a curing agent H of a two-component curable adhesive as a coating liquid to a first web W1; a second coating step of applying the other one of the main agent M and the curing agent H as a coating liquid to a second web W2; and a bonding step of bonding a coating liquid-coated surface of the first web W1 and a coating liquid-coated surface of the second web W2, and of combining the main agent M and the curing agent H to increase a molecular weight. In addition, in the first coating step and the second coating step, the main agent M or the curing agent H is applied by a gravure coater.

Methods and systems for adhesively bonding a first substrate to a second substrate to reduce pull-off stress during separation of the first and second substrates include applying a first adhesive to a first bonding region of a bonding area of the first substrate, applying a second adhesive, which has an adhesive strength that is lower than an adhesive strength of the first adhesive, to a second bonding region of the bonding area of the first substrate, pressing the first and second substrates against each other to form an adhesive bondline, and curing the first and second adhesives for a predetermined period of time to form a cured adhesive bondline between the first and second substrates.

Methods and systems for adhesively bonding a first substrate to a second substrate to reduce pull-off stress during separation of the first and second substrates include applying a first adhesive to a first bonding region of a bonding area of the first substrate, applying a second adhesive, which has an adhesive strength that is lower than an adhesive strength of the first adhesive, to a second bonding region of the bonding area of the first substrate, pressing the first and second substrates against each other to form an adhesive bondline, and curing the first and second adhesives for a predetermined period of time to form a cured adhesive bondline between the first and second substrates.

An electrostatic chuck includes a base plate, a ceramic plate fixed to the base plate and including an electrode embedded in the ceramic plate, and a resin layer bonding the base plate and the ceramic plate and including one or more adhesives. In at least one of the one or more adhesives, a temperature corresponding to an extreme value of a loss tangent in a temperature range of −150° C. to 250° C. is −70° C. or lower.

An electrostatic chuck includes a base plate, a ceramic plate fixed to the base plate and including an electrode embedded in the ceramic plate, and a resin layer bonding the base plate and the ceramic plate and including one or more adhesives. In at least one of the one or more adhesives, a temperature corresponding to an extreme value of a loss tangent in a temperature range of −150° C. to 250° C. is −70° C. or lower.

The instant invention concerns the use of polymers obtained by radical copolymerization of a mixture of (1) acrylic acid; (2) methacrylic acid; and (3) at least one allylcatechol selected from 4-allylbenzene-1,2-diol, 3-allylbenzene-1,2-diol; methylated forms thereof (eugenols); and mixtures thereof, for treating a metallic surface intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

The instant invention concerns the use of polymers obtained by radical copolymerization of a mixture of (1) acrylic acid; (2) methacrylic acid; and (3) at least one allylcatechol selected from 4-allylbenzene-1,2-diol, 3-allylbenzene-1,2-diol; methylated forms thereof (eugenols); and mixtures thereof, for treating a metallic surface intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

The present invention provides solvent-based compostable cold seal release lacquers for use in packaging structures. The lacquers of the invention comprise resins, such as polyamide resins, comprising greater than 90% biobased carbon, generally prepared from renewable sources, e.g., plants such as rice. The present invention also provides the use of the inventive compostable lacquers as cold seal release lacquers in cold seal packaging, along with eco-friendly packaging film, etc., and has the potential to make the cold seal packaging fully compostable.