A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons, and a polycarboxylic acid.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons, and a polycarboxylic acid.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

The present application relates to the field of electronic product heat dissipation component and in particular, relates to a graphene thermally conductive gasket edge-wrapped process and an edge-wrapped graphene thermally conductive gasket. The process steps are: coating a layer of adhesive on the first layer of graphene film, placing the second layer of graphene film on the first layer of graphene film, repeating stacking to the target height, obtaining a graphene film block, punching a plurality of through holes penetrating two surfaces of the graphene film block; threading the carbon fiber through the through holes after coating an adhesive on the surface thereof; slicing along the direction parallel to the thickness direction of the graphene film, to obtain the graphene thermally conductive gasket with a specified thickness; and coating a layer of glue on the peripheral sides of the graphene thermally conductive gasket to form an edge-wrapped layer.

The present application relates to the field of electronic product heat dissipation component and in particular, relates to a graphene thermally conductive gasket edge-wrapped process and an edge-wrapped graphene thermally conductive gasket. The process steps are: coating a layer of adhesive on the first layer of graphene film, placing the second layer of graphene film on the first layer of graphene film, repeating stacking to the target height, obtaining a graphene film block, punching a plurality of through holes penetrating two surfaces of the graphene film block; threading the carbon fiber through the through holes after coating an adhesive on the surface thereof; slicing along the direction parallel to the thickness direction of the graphene film, to obtain the graphene thermally conductive gasket with a specified thickness; and coating a layer of glue on the peripheral sides of the graphene thermally conductive gasket to form an edge-wrapped layer.

The invention relates to a thermally activatable reactive adhesive film comprising a carrier film made of thermoplastic polyurethane, which is coated on at least one side with a latently reactive, thermally activatable adhesive compound.