Embodiments of the present invention are directed to a two-layer adhesive and methods of using the same to secure an electronic device to an organism. In a non-limiting embodiment of the invention, a surface of the organism is coated with a first adhesive layer (bottom layer). The first adhesive layer is cured and a surface of the cured first adhesive layer is coated with a second adhesive layer (top layer). An electronic device is positioned on the second adhesive layer prior to curing the second adhesive layer. The second adhesive layer is then cured, thereby embedding the electronic device within the second adhesive layer. The bottom layer and the top layer are selected such that the bottom layer releases upon exposure to a first solvent after a first duration and the top layer releases upon exposure to a second solvent after a second duration more than the first duration.

Embodiments of the present invention are directed to a two-layer adhesive and methods of using the same to secure an electronic device to an organism. In a non-limiting embodiment of the invention, a surface of the organism is coated with a first adhesive layer (bottom layer). The first adhesive layer is cured and a surface of the cured first adhesive layer is coated with a second adhesive layer (top layer). An electronic device is positioned on the second adhesive layer prior to curing the second adhesive layer. The second adhesive layer is then cured, thereby embedding the electronic device within the second adhesive layer. The bottom layer and the top layer are selected such that the bottom layer releases upon exposure to a first solvent after a first duration and the top layer releases upon exposure to a second solvent after a second duration more than the first duration.

The present invention concerns the field of binders suitable for wood panel manufacturing. In particular, the invention regards a composition of bio-binder comprising unrefined biological material and a reactive prepolymer. In a further aspect a method for producing bio-based binders is presented. In an even further aspect the present invention describes bio-based formaldehyde-free binders obtainable from the described methods and their uses. The invention further describes methods for gluing articles and products obtainable from the methods of the present invention.

The present invention concerns the field of binders suitable for wood panel manufacturing. In particular, the invention regards a composition of bio-binder comprising unrefined biological material and a reactive prepolymer. In a further aspect a method for producing bio-based binders is presented. In an even further aspect the present invention describes bio-based formaldehyde-free binders obtainable from the described methods and their uses. The invention further describes methods for gluing articles and products obtainable from the methods of the present invention.

The present invention is directed to a curable and electrochemically debondable adhesive composition comprising, based on the weight of the composition: from 40 to 99 wt. % of a) at least one ethylenically unsaturated non-ionic monomer; from 0.9 to 50 wt. % of b) at least one polymerizable ionic compound, wherein said polymerizable ionic compound comprises: b1) at least one compound in accordance with general formula IV; and/or b2) at least one compound in accordance with general formula V; and, from 0.1 to 10 wt. % of c) at least one free radical initiator.

##STR00001##

The present invention is directed to a curable and electrochemically debondable adhesive composition comprising, based on the weight of the composition: from 40 to 99 wt. % of a) at least one ethylenically unsaturated non-ionic monomer; from 0.9 to 50 wt. % of b) at least one polymerizable ionic compound, wherein said polymerizable ionic compound comprises: b1) at least one compound in accordance with general formula IV; and/or b2) at least one compound in accordance with general formula V; and, from 0.1 to 10 wt. % of c) at least one free radical initiator.

##STR00001##

The invention relates to a method for theiiiially stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.

The invention is related to a method for bonding components of a PEM fuel cell with a frame and/or amongst one another, wherefore an adhesive curable by electromagnetic radiation in the range of visible light or UV is applied to the frame and/or the at least one component. The invention is characterized in that the adhesive is activated by the electromagnetic radiation and heated after the frame and/or components are brought into contact; or the frame and/or the components are brought into contact and the adhesive is exposed to electromagnetic radiation for activating and heating; to reduce its viscosity before the adhesive is finally cured. The adhesive is a cationic epoxy which contains water.

The invention is related to a method for bonding components of a PEM fuel cell with a frame and/or amongst one another, wherefore an adhesive curable by electromagnetic radiation in the range of visible light or UV is applied to the frame and/or the at least one component. The invention is characterized in that the adhesive is activated by the electromagnetic radiation and heated after the frame and/or components are brought into contact; or the frame and/or the components are brought into contact and the adhesive is exposed to electromagnetic radiation for activating and heating; to reduce its viscosity before the adhesive is finally cured. The adhesive is a cationic epoxy which contains water.

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.