Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Described herein are methods of forming uncured sealant assemblies and also methods of forming seals between various parts using such assemblies. In some examples, an uncured sealant assembly comprises two protective layers and an uncured sealant layer, disposed in between. The uncured sealant assembly is stored and provided at a cure-inhibiting temperature, selected to minimize the curing rate of the uncured sealant layer. The size and the shape of the uncured sealant layer are specifically selected to ensure the complete coverage of the faying surfaces, filling of all gaps and voids between the faying surfaces, and controlling the shape and size of uncured sealant squeeze out between the faying surfaces. In some examples, the size and shape of the uncured sealant layer maybe be specifically selected to have no uncured sealant squeeze out between parts.

Described herein are methods of forming uncured sealant assemblies and also methods of forming seals between various parts using such assemblies. In some examples, an uncured sealant assembly comprises two protective layers and an uncured sealant layer, disposed in between. The uncured sealant assembly is stored and provided at a cure-inhibiting temperature, selected to minimize the curing rate of the uncured sealant layer. The size and the shape of the uncured sealant layer are specifically selected to ensure the complete coverage of the faying surfaces, filling of all gaps and voids between the faying surfaces, and controlling the shape and size of uncured sealant squeeze out between the faying surfaces. In some examples, the size and shape of the uncured sealant layer maybe be specifically selected to have no uncured sealant squeeze out between parts.

The present disclosure relates to a two-component polyurethane adhesive, based on a polyol component A and a polyisocyanate component B. The two-component polyurethane adhesive exhibits fast cure speed, good adhesion properties and good durability. The two-component polyurethane adhesive is developed for the adhesion adhesion of substrates, wherein the substrates are preferably selected from the group comprising sheet molding compounds (SMCs) and plastic substrates.

The present disclosure relates to a two-component polyurethane adhesive, based on a polyol component A and a polyisocyanate component B. The two-component polyurethane adhesive exhibits fast cure speed, good adhesion properties and good durability. The two-component polyurethane adhesive is developed for the adhesion adhesion of substrates, wherein the substrates are preferably selected from the group comprising sheet molding compounds (SMCs) and plastic substrates.

A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.