In some embodiments, a printed laminate comprises a first substrate having a first side and a second side, an ink layer at least partially adhered through direct printing to the first side of the first substrate, and a second substrate comprising a heat activatable adhesive and having a first side and a second side. The first side of the second substrate may be at least partially laminated to the second side of the first substrate.

A composite membrane comprising (i) a polymeric membrane panel, said panel having first and second planar surfaces; (ii) a cross-linked adhesive layer disposed on said first planar surface of said polymeric membrane panel, said cross-linked adhesive layer having first and second planar surfaces, where said first planar surface of said cross-linked adhesive layer is in contact with said first planar surface of said polymeric membrane panel; and (iii) an optional release member disposed on said second planar surface of said cross-linked adhesive layer, where said polymeric membrane panel includes a functionalized polymer at said second planar surface.

A composite membrane comprising (i) a polymeric membrane panel, said panel having first and second planar surfaces; (ii) a cross-linked adhesive layer disposed on said first planar surface of said polymeric membrane panel, said cross-linked adhesive layer having first and second planar surfaces, where said first planar surface of said cross-linked adhesive layer is in contact with said first planar surface of said polymeric membrane panel; and (iii) an optional release member disposed on said second planar surface of said cross-linked adhesive layer, where said polymeric membrane panel includes a functionalized polymer at said second planar surface.

Phthalonitrile adhesive formulations are provided. Such an adhesive formulation may comprise an etherimide-phthalonitrile oligomer having formula

##STR00001## wherein R.sub.1 is an unsubstituted or substituted aryl group or an unsubstituted or substituted cycloalkyl group; R.sub.2 is an unsubstituted or substituted aryl group and n has a value of from 1 to 30. Also provided are methods of making and using the adhesive formulations.

Phthalonitrile adhesive formulations are provided. Such an adhesive formulation may comprise an etherimide-phthalonitrile oligomer having formula

##STR00001## wherein R.sub.1 is an unsubstituted or substituted aryl group or an unsubstituted or substituted cycloalkyl group; R.sub.2 is an unsubstituted or substituted aryl group and n has a value of from 1 to 30. Also provided are methods of making and using the adhesive formulations.

A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa.Math.s) when a shearing speed is 5 (sec.sup.−1) and is from 1 to 30 (Pa.Math.s) when the shearing speed is 200 (sec.sup.−1).

Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa.Math.s) when a shearing speed is 5 (sec.sup.−1) and is from 1 to 30 (Pa.Math.s) when the shearing speed is 200 (sec.sup.−1).

A bonding method using adhesive sheets respectively containing first and second thermoplastic resins. The volume content VA1 of the first thermoplastic resin in the adhesive sheet and the volume content VA2 of the second thermoplastic resin in the adhesive sheet are from 60 vol % to 100 vol %. Change rates Vx1 and Vx2 represented by formulae below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first adhesive layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second adhesive layer. The method includes applying a high-frequency wave to the adhesive sheets between adherends to bond them together,

Vx1={(VA1−VB1)/VA1}×100  (Numerical Formula 1)

Vx2={(VA2−VB2)/VA2}×100  (Numerical Formula 2).