A bonding method using adhesive sheets respectively containing first and second thermoplastic resins. The volume content VA1 of the first thermoplastic resin in the adhesive sheet and the volume content VA2 of the second thermoplastic resin in the adhesive sheet are from 60 vol % to 100 vol %. Change rates Vx1 and Vx2 represented by formulae below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first adhesive layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second adhesive layer. The method includes applying a high-frequency wave to the adhesive sheets between adherends to bond them together,

Vx1={(VA1−VB1)/VA1}×100  (Numerical Formula 1)

Vx2={(VA2−VB2)/VA2}×100  (Numerical Formula 2).

The present disclosure provides a two-component polyurethane adhesive composition and a bonding method thereof. The two-component polyurethane adhesive composition includes A) a polyol component, and B) an isocyanate component. The polyol component includes A1) one or more polyether polyols, and the isocyanate component includes B1) a first isocyanate prepolymer, wherein the first isocyanate prepolymer is polymerized from isocyanate and a non-linear chain extender. The two-component polyurethane adhesive composition of the present disclosure has good mechanical properties, in particular, high G modulus and high elongation. The polyol component in the two-component polyurethane adhesive composition has good phase stability, and good miscibility with the isocyanate component. The two-component polyurethane adhesive composition of the present disclosure can be used for the production and manufacture of mechanical parts such as automobile components.

The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.

Cyanoacrylate compositions are provided, which when cured provide improved hot strength performance without compromising thermal resistance performance.

Cyanoacrylate compositions are provided, which when cured provide improved hot strength performance without compromising thermal resistance performance.

Provided is an adhesive application system configured to apply a necessary and sufficient amount of an adhesive to a thin steel strip without causing an increase in the equipment cost. The adhesive application system comprises an adhesive application device having adhesive dispensing nozzles (26, 27) for dispensing an adhesive to an adhesive application surface of a thin steel strip; a mechanism configured to elevate and lower the adhesive application device; and adhesive supply ports (17, 18) for supplying the adhesive at a predetermined pressure to the adhesive application device, wherein the adhesive application device has an end face that is to be brought into abutment against the thin steel strip, and wherein outlets of the adhesive dispensing nozzles (26, 27) are spaced inwardly away from the end face of the adhesive application device so that the outlets of the adhesive dispensing nozzles (26, 27) are maintained at a predetermined distance from a lower surface of the thin steel strip.

Provided is an adhesive application system configured to apply a necessary and sufficient amount of an adhesive to a thin steel strip without causing an increase in the equipment cost. The adhesive application system comprises an adhesive application device having adhesive dispensing nozzles (26, 27) for dispensing an adhesive to an adhesive application surface of a thin steel strip; a mechanism configured to elevate and lower the adhesive application device; and adhesive supply ports (17, 18) for supplying the adhesive at a predetermined pressure to the adhesive application device, wherein the adhesive application device has an end face that is to be brought into abutment against the thin steel strip, and wherein outlets of the adhesive dispensing nozzles (26, 27) are spaced inwardly away from the end face of the adhesive application device so that the outlets of the adhesive dispensing nozzles (26, 27) are maintained at a predetermined distance from a lower surface of the thin steel strip.

The present disclosure relates to structural bonding compositions and attachment brackets, and their use in photovoltaic solar modules. Another aspect of the present disclosure relates to methods of affixing an attachment bracket to a solar module during the lamination step used to manufacture the module.

The present disclosure relates to structural bonding compositions and attachment brackets, and their use in photovoltaic solar modules. Another aspect of the present disclosure relates to methods of affixing an attachment bracket to a solar module during the lamination step used to manufacture the module.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.