A battery and a method of constructing a battery are disclosed in which a first conductive substrate portion has a first face and a second conductive substrate portion has a second face opposed to the first face. A first electrode material is disposed in electrical contact with the first face, an electrolyte material is disposed in contact with the first electrode material, a second electrode material is disposed in contact with the electrolyte material, and a conductive tab disposed in contact with the second electrode material. The first conductive substrate portion, the first electrode material, and the conductive tab extend outward beyond a particular edge of the second conductive substrate portion.

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

The present teachings contemplate a method comprising coating a poly(vinyl chloride) material with a composition including a dicarbonyl compound, a cyanoacrylate compound, or a combination thereof and a viscosity modifying agent so that the composition has a viscosity of from about 50 cps to about 2500 cps; wherein the coated poly(vinyl chloride) material is capable of adhering to a second material without the use of a primer.

The present teachings contemplate a method comprising coating a poly(vinyl chloride) material with a composition including a dicarbonyl compound, a cyanoacrylate compound, or a combination thereof and a viscosity modifying agent so that the composition has a viscosity of from about 50 cps to about 2500 cps; wherein the coated poly(vinyl chloride) material is capable of adhering to a second material without the use of a primer.

The present disclosure provides an adhesive tape, a backlight module, a display device, and a method for manufacturing a backlight module. The adhesive tape includes: an adhesive body layer; an expandable structure layer on a side of the adhesive body layer and configured to fill a gap between the adhesive tape and a light guide plate of a backlight module through an expansion of the expandable structure layer.

The present disclosure provides an adhesive tape, a backlight module, a display device, and a method for manufacturing a backlight module. The adhesive tape includes: an adhesive body layer; an expandable structure layer on a side of the adhesive body layer and configured to fill a gap between the adhesive tape and a light guide plate of a backlight module through an expansion of the expandable structure layer.

A method of making an adhesive for an ice protection assembly includes mixing ferrous nanoparticles into the adhesive. Removal of the adhesive for ice protection assembly inspection or repair includes heating the ferrous nanoparticles in the adhesive to soften the adhesive and allow for easy removal or repositioning of the ice protection assembly.

A method of making an adhesive for an ice protection assembly includes mixing ferrous nanoparticles into the adhesive. Removal of the adhesive for ice protection assembly inspection or repair includes heating the ferrous nanoparticles in the adhesive to soften the adhesive and allow for easy removal or repositioning of the ice protection assembly.

A plasticizer may be suitable for resins and contain an amorphous propylenic polymer having a weight-average molecular weight (Mw), measured according to a GPC method, in a range of from 5,000 to 30,000 and having a molecular weight distribution (Mw/Mn) of 3.0 or less. The amorphous propylenic polymer may be a propylene homopolymer