C09J5/06

HOT MELT TAPE FOR VELCRO WITHOUT SEWING AND METHOD FOR MANUFACTURING SEAT PADDING MATERIAL FOR VEHICLES USING THE SAME
20230220245 · 2023-07-13 ·

Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.

HOT MELT TAPE FOR VELCRO WITHOUT SEWING AND METHOD FOR MANUFACTURING SEAT PADDING MATERIAL FOR VEHICLES USING THE SAME
20230220245 · 2023-07-13 ·

Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.

Water-based Lignin-Particle-Epoxy Surface Coatings, Thermosets and Adhesives
20230220193 · 2023-07-13 ·

According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

Water-based Lignin-Particle-Epoxy Surface Coatings, Thermosets and Adhesives
20230220193 · 2023-07-13 ·

According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

Adhesive composition and preparation method and use thereof
20230220253 · 2023-07-13 ·

The invention relates to an adhesive composition, the preparation and use of said composition, and an article obtained by bonding using said composition. The adhesive composition comprises: a. an anionic aqueous polyurethane dispersion, which contains a polyurethane with enthalpy of fusion of at least 3 J/g, wherein the enthalpy of fusion is measured by DSC at 20° C.-100° C. of the first heating curve according to DIN 65467; and wherein said aqueous polyurethane dispersion has a hydroxyl content of 0.001% by weight to 0.085% by weight, relative to the total weight of the aqueous polyurethane dispersion; and b. an aqueous polyacrylate primary dispersion with a hydroxyl content of 0.5% by weight to 1.8% by weight, relative to the total weight of the aqueous polyacrylate primary dispersion; wherein the amount of the aqueous polyurethane dispersion is 30% by weight to 91% by weight, and the amount of the aqueous polyacrylate primary dispersion is 9% by weight to 70% by weight, the above weight percentages being relative to the total weight of the adhesive composition. The adhesive composition of the present invention has good high-temperature resistance.

Adhesive composition and preparation method and use thereof
20230220253 · 2023-07-13 ·

The invention relates to an adhesive composition, the preparation and use of said composition, and an article obtained by bonding using said composition. The adhesive composition comprises: a. an anionic aqueous polyurethane dispersion, which contains a polyurethane with enthalpy of fusion of at least 3 J/g, wherein the enthalpy of fusion is measured by DSC at 20° C.-100° C. of the first heating curve according to DIN 65467; and wherein said aqueous polyurethane dispersion has a hydroxyl content of 0.001% by weight to 0.085% by weight, relative to the total weight of the aqueous polyurethane dispersion; and b. an aqueous polyacrylate primary dispersion with a hydroxyl content of 0.5% by weight to 1.8% by weight, relative to the total weight of the aqueous polyacrylate primary dispersion; wherein the amount of the aqueous polyurethane dispersion is 30% by weight to 91% by weight, and the amount of the aqueous polyacrylate primary dispersion is 9% by weight to 70% by weight, the above weight percentages being relative to the total weight of the adhesive composition. The adhesive composition of the present invention has good high-temperature resistance.

High frequency adhesive bonding
11691351 · 2023-07-04 · ·

A system and method for bonding a first layer of material to a second layer of material includes a first electrically conductive plate, a second electrically conductive plate spaced apart from the first electrically conductive plate. The second electrically conductive plate is electrically grounded. A high frequency generator in electrical communication with the first electrically conductive plate supplies high frequency electrical signals to the first electrically conductive plate. An adhesive applied to one of the first and second layers of material has an electromagnetic susceptor material that when subjected to the electric field heats the adhesive to an adhesive curing temperature to bond the first layer of material to the second layer of material. A clamping mechanism applies pressure to one of the first and second layers of material to maintain contact between the first and second layers until an adhesive cure time has lapsed.

Methods of disassembling apparel products having shape memory adhesives

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Methods of disassembling apparel products having shape memory adhesives

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Dielectric-heating bonding film and bonding method using dielectric-heating bonding film
11541607 · 2023-01-03 · ·

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.