A laminate composite material (1), suitable for the packaging of food products and having a multilayer structure comprising: a first outer layer (21) of paper or plastic film; an inner layer (22) of adhesive; and an intermediate layer (23) interposed between the first and the second layer and made of sodium silicate (Na.sub.2O×SiO.sub.2).

A method of adhesive weld bonding a light metal workpiece and a steel workpiece is disclosed that includes applying a plurality of discrete adhesive ribbons to a faying surface of the light metal workpiece, the faying surface of the steel workpiece, or both faying surfaces, and then assembling the workpieces together to establish one or more adhesive zones between the faying surfaces of the light metal and steel workpieces and a plurality of adhesive free zones amongst the adhesive zone(s). The method further includes forming a resistance spot weld that bonds the the light metal workpiece and the steel workpiece together at a spot weld location within one of the adhesive free zones. The formed spot weld includes a weld joint contained within the light metal workpiece that bonds to the faying interface of the steel workpiece.

A method of adhesive weld bonding a light metal workpiece and a steel workpiece is disclosed that includes applying a plurality of discrete adhesive ribbons to a faying surface of the light metal workpiece, the faying surface of the steel workpiece, or both faying surfaces, and then assembling the workpieces together to establish one or more adhesive zones between the faying surfaces of the light metal and steel workpieces and a plurality of adhesive free zones amongst the adhesive zone(s). The method further includes forming a resistance spot weld that bonds the the light metal workpiece and the steel workpiece together at a spot weld location within one of the adhesive free zones. The formed spot weld includes a weld joint contained within the light metal workpiece that bonds to the faying interface of the steel workpiece.

Weldable adhesive compositions that dampen noise or vibration are described. In addition, various tape products that include the adhesive compositions are described. Also described are various methods of damping noise or vibration by use of the adhesive compositions and tapes. In addition, vibration damping assemblies utilizing the adhesives are described.

Weldable adhesive compositions that dampen noise or vibration are described. In addition, various tape products that include the adhesive compositions are described. Also described are various methods of damping noise or vibration by use of the adhesive compositions and tapes. In addition, vibration damping assemblies utilizing the adhesives are described.

A spot welding method for welding a first panel and a second panel by applying a current between a pair of electrodes in pairs in a state in which the first panel and the second panel overlap one another and are held by the electrodes includes: forming a protrusion on a surface facing the second panel, at a welding-target part of the first panel; forming a recess on a surface facing the protrusion, at a welding-target part of the second panel, such that the recess has a depth that allows a top of the protrusion to come into contact with a bottom of the recess; and holding the welding-target part of the first panel and the welding-target part of the second panel between the electrodes, in a state in which the protrusion is inserted in the recess and applying the current between the electrodes.

This adhesively joined structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion includes an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group; an organic compound phase formed of an organic silicon compound; and optionally an inorganic compound phase formed of an inorganic silicon compound. The total volume percentage of the organic compound phase and the inorganic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the organic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the inorganic compound phase to the total volume of the film portion is limited to 10 vol % or less. The organic silicon compound includes a Si—C bond; and a Si—O bond or a Si—OH bond or a a combination thereof.

This adhesively joined structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion includes an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group; an organic compound phase formed of an organic silicon compound; and optionally an inorganic compound phase formed of an inorganic silicon compound. The total volume percentage of the organic compound phase and the inorganic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the organic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the inorganic compound phase to the total volume of the film portion is limited to 10 vol % or less. The organic silicon compound includes a Si—C bond; and a Si—O bond or a Si—OH bond or a a combination thereof.

The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.

A heat-resistant weld backing tape for placement between a backing member and a workpiece to be welded at a root gap. The weld backing tape includes a flexible tape substrate. The tape substrate has a longitudinal length that extends between first and second tape substrate ends, and a lateral width that extends between first and second tape substrate side edges. The tape substrate has a substantially planar first face and a substantially planar second face. The first and second tape substrate faces are mutually parallel and spaced from each other by a tape substrate thickness. The tape substrate length and the tape substrate width are substantially larger than the tape substrate thickness. A heat-resistant material is disposed on the first tape substrate face and arranged to face the workpiece during welding. An adhesive material is disposed on the second tape substrate face and arranged to face the backing member during welding.