Patent classifications
C09J7/10
ELONGATED ELASTIC SEAM TAPE WITH ELECTRICAL CONDUCTOR
The present invention relates to an elongated elastic seam tape comprising an elongated elastic conductor as well as to a method of manufacturing such an elongated elastic seam tape.
PRESSURE-SENSITIVE ADHESIVE COMPOUNDS, AND SELF-ADHESIVE PRODUCTS AND COMPOSITES COMPRISING THE LATTER
The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.
A CURABLE COMPOSITION AND A METHOD FOR ADHERING SUBSTRATES WITH THE SAME
Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.
A CURABLE COMPOSITION AND A METHOD FOR ADHERING SUBSTRATES WITH THE SAME
Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.
DOUBLE-SIDED ADHESIVE TAPE
Provided is a double-sided pressure-sensitive adhesive tape excellent in reworkability. A double-sided pressure-sensitive adhesive tape according to an embodiment of the present invention includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the double-sided pressure-sensitive adhesive tape has a load at an elongation of 100% of 7 N/10 mm or less, and wherein the double-sided pressure-sensitive adhesive tape has a load at an elongation of 500% of 20 N/10 mm or less.
DOUBLE-SIDED ADHESIVE TAPE
A double-sided pressure-sensitive adhesive includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the acrylic pressure-sensitive adhesive composition contains an acrylic partially polymerized product obtained by polymerizing a monomer component (m1), a monomer component (m2), a cross-linking agent, and a photopolymerization initiator, wherein the monomer component (m2) contains an alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms, and a polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more, and wherein in the monomer component (m2), a content of the polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more is from 10 parts by weight to 90 parts by weight with respect to 100 parts by weight of the alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms.
Adhesive film, anti-PID encapsulation adhesive film, composition forming adhesive film, and photovoltaic module and laminated glass
Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.
Adhesive film, anti-PID encapsulation adhesive film, composition forming adhesive film, and photovoltaic module and laminated glass
Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.
Electronic Devices With Multilayer Adhesive
In devices with flexible displays, multilayer adhesive stacks may be included. A multilayer adhesive may attach a flexible display panel to the display cover layer in an electronic device. Including multiple layers of adhesive in the adhesive stack (as opposed to a single layer) provides more degrees of freedom for the tuning and optimization of the properties of the adhesive stack. The multilayer adhesive stack therefore has better performance than if only a single layer of adhesive is used. The multilayer adhesive stack may include one or more layers of soft adhesive, hard adhesive, hard elastomer, hard polymer, and/or glass to optimize the mechanical and optical performance of the multilayer adhesive stack. Soft adhesive layers may be included to optimize lateral decoupling (e.g., during folding and unfolding) of the adhesive stack. Harder layers may be included to provide rigidity and prevent denting during impact events.
Polymeric films and display devices containing such films
Polymeric films, which may be adhesive films, and display devices including such polymeric films, wherein a polymeric film includes: a first polymeric layer having two major surfaces, wherein the first polymeric layer includes a first polymeric matrix and particles. The first polymeric layer includes: a first a polyolefin-based low WVTR adhesive polymeric matrix having a refractive index n.sub.1; and particles having a refractive index n.sub.2 uniformly dispersed within the first polymeric matrix; wherein the particles are present in an amount of less than 30 vol-%, based on the volume of the first polymeric layer, and have a particle size range of 400 nanometers (nm) to 3000 nm; and wherein n.sub.1 is different than n.sub.2.