Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.

A set of structurally insulated panels and method of building construction, the set of panels having an indexing system that allows for any one panel to be easily attached to any other panel via indexing pins placed in pre-arranged openings. The indexing system enables essentially any number of panels to be assembled in essentially any reasonable manner to construct a building structure.

A set of structurally insulated panels and method of building construction, the set of panels having an indexing system that allows for any one panel to be easily attached to any other panel via indexing pins placed in pre-arranged openings. The indexing system enables essentially any number of panels to be assembled in essentially any reasonable manner to construct a building structure.

The purpose of the present invention is to provide a double-sided adhesive film which has a generally equal elongation in the XY (longitudinal and transverse) directions, more preferably in the thickness direction, while being prevented from the occurrence of adhesive protrusion or glue burr, and which has higher adhesive force and higher holding power in comparison to similar single-layer adhesive articles, while being applicable to a stretchable or flexible adherend. A double-sided adhesive film according to the present invention is a substrate-less double-sided adhesive film which is composed of a center layer that is formed of a resin adhesive, and adhesive layers that are superposed on the front surface and the back surface of the center layer, said adhesive layers being formed of a resin that is the same as or similar to the resin that constitutes the center layer, wherein the weight average molecular weight or the crosslinking degree of the resin that constitutes the center layer is higher than the weight average molecular weight or the crosslinking degree of the resin that constitutes the adhesive layers. This double-sided adhesive film is characterized in that the tolerance between the elongation in the longitudinal direction and the elongation in the transverse direction is ±20% or less relative to one of the elongations, more preferably, the elongation in the longitudinal direction and the elongation in the transverse direction are equal to each other.

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability and transparency while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A), a mixture of monomer components constituting the acrylic polymer (A) or a partially polymerized product of a mixture of monomer components constituting the acrylic polymer (A), and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive composition comprises a branched-chain alkyl group having 10 to 24 carbon atoms as a monomer component. The hydrogenated polyolefinic resin (B) has a number average molecular weight (Mn) of 1000 to 5000 and a polydispersity (Mw/Mn) of 2.0 or less. The hydrogenated polyolefinic resin (B) contains at least one selected from the group consisting of a hydrogenated polyolefin and a hydrogenated polyolefin polyol. The pressure-sensitive adhesive composition comprises 3 to 35 parts by weight of the hydrogenated polyolefinic resin (B) based on 100 parts by weight of the acrylic polymer (A).

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability and transparency while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A), a mixture of monomer components constituting the acrylic polymer (A) or a partially polymerized product of a mixture of monomer components constituting the acrylic polymer (A), and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive composition comprises a branched-chain alkyl group having 10 to 24 carbon atoms as a monomer component. The hydrogenated polyolefinic resin (B) has a number average molecular weight (Mn) of 1000 to 5000 and a polydispersity (Mw/Mn) of 2.0 or less. The hydrogenated polyolefinic resin (B) contains at least one selected from the group consisting of a hydrogenated polyolefin and a hydrogenated polyolefin polyol. The pressure-sensitive adhesive composition comprises 3 to 35 parts by weight of the hydrogenated polyolefinic resin (B) based on 100 parts by weight of the acrylic polymer (A).

A living engineered glue system for performing autonomous mechanical repairs comprises a biofilm of microbial cells embedded in an extracellular matrix and operably linked in an environmentally-inducible, cell-cell communication genetic circuit to control gene expression.

The present invention relates to a pressure-sensitive adhesive comprising at least one poly(meth)acrylate; and at least one acrylonitrile-butadiene rubber, wherein
the at least one acrylonitrile-butadiene rubber is present at 1 to 49 wt %, based on the total weight of the pressure-sensitive adhesive. The invention further relates to the production of a pressure-sensitive adhesive of the invention and also to the use of the pressure-sensitive adhesive of the invention for the bonding of components of electronic devices or of components in automobiles. Lastly the present invention relates to an adhesive tape comprising at least one layer of a pressure-sensitive adhesive according to the present invention.

The present invention relates to a pressure-sensitive adhesive comprising at least one poly(meth)acrylate; and at least one acrylonitrile-butadiene rubber, wherein
the at least one acrylonitrile-butadiene rubber is present at 1 to 49 wt %, based on the total weight of the pressure-sensitive adhesive. The invention further relates to the production of a pressure-sensitive adhesive of the invention and also to the use of the pressure-sensitive adhesive of the invention for the bonding of components of electronic devices or of components in automobiles. Lastly the present invention relates to an adhesive tape comprising at least one layer of a pressure-sensitive adhesive according to the present invention.

Disclosed is a polyurethane hot-melt adhesive including: a thermoplastic polyurethane that is a reactant of a raw material including a polymer polyol, a polyisocyanate, and a chain extender, wherein X−Y≥15, where X represents a temperature (° C.) at which the polyurethane hot-melt adhesive has a melt viscosity of 2.0×10.sup.3 Pa.Math.s, and Y represents a temperature at which the polyurethane hot-melt adhesive has a melt viscosity of 1.0×10.sup.5 Pa.Math.s, and the polyurethane hot-melt adhesive has a 100% modulus of 2.5 MPa or more.