Described are viscoelastic damping materials and constructions which may demonstrate low temperature performance and adhesion and which may be used in making vibration damping composites. Viscoelastic damping materials and constructions may include polymers or copolymers of monomers according to formula I:
CH.sub.2═CHR.sup.1—COOR.sup.2  [I]
wherein R.sup.1 is H, CH.sub.3 or CH.sub.2CH.sub.3 and R.sup.2 is a branched alkyl group containing 12 to 32 carbon atoms.

A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

The invention utilizes swelling and fusion effects of graphene oxide in a solvent to implement cross-linked bonding of a graphene material itself and materials such as polymers, metal, paper, glass, carbon materials, and ceramics. The present invention not only overcomes the shortcoming in traditional adhesives of residual formaldehyde, but also has short drying time, high bonding strength and high corrosion resistance. The present invention is widely applied in the fields of aviation, aerospace, automobiles, machinery, construction, chemical, light industry, electronics, electrical appliances, and daily life, etc.

A two-part epoxy coating composition for producing an adherent coating for articles such as large liquid storage tanks. The two-part epoxy coating composition includes a first liquid comprising a polyepoxide having a described formula and having an estrogenic agonist activity less than that of bisphenol S, and a second liquid comprising a curing agent configured to react with the polyepoxide under ambient conditions.

A two-part epoxy coating composition for producing an adherent coating for articles such as large liquid storage tanks. The two-part epoxy coating composition includes a first liquid comprising a polyepoxide having a described formula and having an estrogenic agonist activity less than that of bisphenol S, and a second liquid comprising a curing agent configured to react with the polyepoxide under ambient conditions.

The present invention provides an adhesive composition that shows good adhesion to a polyolefin resin substrate and a metal substrate, and good electrolyte solution resistance, and also exhibits excellent heat resistance. The present invention also provides a laminate including an adhesive layer comprising the adhesive composition, a packaging material using the laminate for which heat resistance and electrolyte solution resistance are required, and a packaging material for a lithium-ion battery comprising the laminate as a constituent member. The adhesive composition comprises an acid-modified polyolefin (A), an isocyanate curing agent (B), and an acid anhydride group-containing compound (C), the acid anhydride group-containing compound (C) being present in an amount of 0.1 parts by mass or more and 20 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin (A).

The present invention provides an adhesive composition that shows good adhesion to a polyolefin resin substrate and a metal substrate, and good electrolyte solution resistance, and also exhibits excellent heat resistance. The present invention also provides a laminate including an adhesive layer comprising the adhesive composition, a packaging material using the laminate for which heat resistance and electrolyte solution resistance are required, and a packaging material for a lithium-ion battery comprising the laminate as a constituent member. The adhesive composition comprises an acid-modified polyolefin (A), an isocyanate curing agent (B), and an acid anhydride group-containing compound (C), the acid anhydride group-containing compound (C) being present in an amount of 0.1 parts by mass or more and 20 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin (A).

To provide a double-sided pressure-sensitive adhesive sheet having high flexing resistance that does not suffer flexure and exfoliation in a flexing test that is closer to the actual use environment. A double-sided pressure-sensitive adhesive sheet having no substrate, containing a pressure-sensitive adhesive composition containing a (meth)acrylate ester (co)polymer (A), and having a glass transition temperature (Tg) defined by a Tan δ peak temperature of dynamic viscoelasticity in a range of −50° C. to −20° C., a storage elastic modulus G′ at a frequency of 1 Hz and a temperature 100° C. in a range of 2.0×10.sup.3 to 3.0×10.sup.4 Pa, and a thickness of 10 μm or more and 150 μm or less.

To provide a double-sided pressure-sensitive adhesive sheet having high flexing resistance that does not suffer flexure and exfoliation in a flexing test that is closer to the actual use environment. A double-sided pressure-sensitive adhesive sheet having no substrate, containing a pressure-sensitive adhesive composition containing a (meth)acrylate ester (co)polymer (A), and having a glass transition temperature (Tg) defined by a Tan δ peak temperature of dynamic viscoelasticity in a range of −50° C. to −20° C., a storage elastic modulus G′ at a frequency of 1 Hz and a temperature 100° C. in a range of 2.0×10.sup.3 to 3.0×10.sup.4 Pa, and a thickness of 10 μm or more and 150 μm or less.