Materials and methods for mitigating passive intermodulation. A membrane for reducing passive intermodulation includes a first polymeric layer, a second polymeric layer, and a continuous metal layer encapsulated between the first and second polymeric layers. A self-adhesive radio frequency barrier tape includes a waterproof polymeric top layer, a metal-containing layer adhered by an adhesive layer to the polymeric top layer, a pressure sensitive adhesive layer adhered to the metal-containing layer, and a release liner on a bottom surface of the pressure sensitive adhesive layer. A method of mitigating passive intermodulation includes passing a probe over an area of interest, the probe being sensitive to an intermodulation frequency of interest, and identifying a suspected source of passive intermodulation when the amplitude of the probe output exceeds a threshold at the frequency of interest. The method further includes covering the suspected passive intermodulation source with a radio frequency barrier material.

A screen protector application kit includes a glass-based substrate (110) having an adhesive belt (270) and an adhesive container (478) of an uncured adhesive composition. The adhesive belt (270) includes a first major surface (272) adhered to the glass-based substrate (110), a second major surface (274), a distal edge (276) extending between the first major surface (272) and the second major surface (274), and a proximal edge (278) extending between the first major surface (272) and the second major surface (274). The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The uncured adhesive composition may further include 0.1 wt % to 10 wt % of a co-initiator. The uncured adhesive composition may further include 0.1 wt % to 5 wt % of an oxygen inhibitor.

A screen protector application kit includes a glass-based substrate (110) having an adhesive belt (270) and an adhesive container (478) of an uncured adhesive composition. The adhesive belt (270) includes a first major surface (272) adhered to the glass-based substrate (110), a second major surface (274), a distal edge (276) extending between the first major surface (272) and the second major surface (274), and a proximal edge (278) extending between the first major surface (272) and the second major surface (274). The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The uncured adhesive composition may further include 0.1 wt % to 10 wt % of a co-initiator. The uncured adhesive composition may further include 0.1 wt % to 5 wt % of an oxygen inhibitor.

A method of installing a roof system includes providing a first membrane composite; adhesively securing the first membrane composite to a roof surface through a UV-cured pressure-sensitive adhesive layer; providing a second membrane composite; adhesively securing the second membrane composite to the roof surface through a UV-cured pressure-sensitive adhesive layer, where the second membrane composite is positioned adjacent to and partially overlapping a lap area of the first membrane composite; and adhesively securing the second membrane composite to a first planar surface of the first membrane composite along a primer layer through the UV-cured pressure-sensitive adhesive layer disposed on the second membrane composite.

Systems and methods for mating component parts are described. In some embodiments, a system for mating components may include a first component, a second component, a first adhesive, and a second adhesive. The first adhesive may be configured to set in less than 5 minutes after the first component and the second component are placed in a mating position, and the second adhesive may require greater than 5 minutes to set. The first adhesive, after setting, may have sufficient strength to maintain the first component and the second component in the mating position while the second adhesive sets.

Systems and methods for mating component parts are described. In some embodiments, a system for mating components may include a first component, a second component, a first adhesive, and a second adhesive. The first adhesive may be configured to set in less than 5 minutes after the first component and the second component are placed in a mating position, and the second adhesive may require greater than 5 minutes to set. The first adhesive, after setting, may have sufficient strength to maintain the first component and the second component in the mating position while the second adhesive sets.

A structural reinforcement for an article including a carrier that includes: (i) a mass of polymeric material having an outer surface; and (ii) at least one consolidated fibrous insert (14) having an outer surface and including at least one elongated fiber arrangement having a plurality of ordered fibers arranged in a predetermined manner. The fibrous insert is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert and the mass of polymeric material are of compatible materials, structures or both, for allowing the fibrous insert to be at least partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier may be a mass of activatable material.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

A nail sticker, a composition for the nail sticker and a method for preparing the composition are disclosed. Raw materials of the composition include a sizing material, which is made of the following raw materials in parts by weight: 45-85 parts of a UV thermosetting resin, 2-9 parts of a photoinitiator, 1.5-2 parts of a curing agent, 0.1-1 part of a thermal promoter, and 0.1-1 part of a leveling agent. The synchronization of the release of essential oil molecules with light/thermal curing promotes the essential oil molecules to be diffused to the interior of the sizing material more uniformly in a wider range, and during the curing and film forming of the nail sticker, an aroma spreads as tantalizing as that of baked food.