Provided are a compound expressed by a particular chemical formula, an anti-reflective film, and a display device including the anti-reflective film.

Disclosed is a high-penetration hot melt adhesive for separation apparatus, such as thin film composite reverse osmosis filtration membranes. Also disclosed is a method of using these hot melt adhesives to bond these membranes to one or more other components of a separation apparatus.

Disclosed is a high-penetration hot melt adhesive for separation apparatus, such as thin film composite reverse osmosis filtration membranes. Also disclosed is a method of using these hot melt adhesives to bond these membranes to one or more other components of a separation apparatus.

Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

The present invention relates to a urethane prepolymer having an isocyanate group, a viscosity at 100° C. of 30 to 600 dPa.Math.s, and a thermal softening temperature after moisture curing of 75 to 155° C.

Provided are a UV curable composition which can be cured without undergoing a high-temperature heating step and has excellent adhesiveness and mechanical strength; and a sheet using the same. This UV curable composition includes a rubber component having a diene skeleton, a photopolymerization initiator, and a cross-linking agent, wherein the rubber component having a diene skeleton contains a solid rubber component and a liquid rubber component at 25° C. The UV curable composition can be cured by UV irradiation in a short time, and can thus be applied to not only an adherend having high heat resistance but also a wide range of members.

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

##STR00001##

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

##STR00001##

An adhesive film including a first adhesive layer, wherein the first adhesive layer contains a first adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles that are dendritic conductive particles, and second conductive particles that are conductive particles other than the first conductive particles, each conductive particle containing a non-conductive core and a conductive layer provided on the core, and a part of the plurality of conductive particles is disposed to protrude from one surface of the first adhesive layer.