An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec.sup.−1 and measured at a temperature of 120° C., being 5.0×10.sup.3 poise to 1.0×10.sup.5 poise inclusive.

An adherable element is disclosed, comprising a decorative element having a support surface, and a pressure activated adhesive system pre-coated on the support surface of the decorative element for adhering the decorative element to a surface, the adhesive remaining uncured until activated by application of a threshold pressure. The adhesive comprises a matrix comprising a hardener and a plurality of microcapsules filled with an adhesive resin, the microcapsules being configured to rupture on application of the threshold pressure, thereby exposing the resin to the matrix and allowing the resin to react with the hardener to form an adhesive bond between the decorative element and the surface. The matrix may further comprise a rheology additive such that the matrix has a higher viscosity than the hardener at room temperature. Methods of making an adherable element, and decorative articles comprising the adherable element are also disclosed.

A composite membrane comprising (i) a polymeric membrane panel, said panel having first and second planar surfaces; (ii) a cross-linked adhesive layer disposed on said first planar surface of said polymeric membrane panel, said cross-linked adhesive layer having first and second planar surfaces, where said first planar surface of said cross-linked adhesive layer is in contact with said first planar surface of said polymeric membrane panel; and (iii) an optional release member disposed on said second planar surface of said cross-linked adhesive layer, where said polymeric membrane panel includes a functionalized polymer at said second planar surface.

An object of the present invention is to provide a sealing method using a cover film where a problem of odor is not likely to occur and quick drying properties and sealability are high.

The sealing method according to the present invention is a sealing method that is performed using at least a cover film and a sealing solvent, the cover film including a polymer layer provided on a transparent support, in which the sealing solvent is a solvent including at least one kind selected from the group consisting of an ester, an alcohol, a ketone, an ether, and an aromatic hydrocarbon, in a case where the sealing solvent is an ester, an alcohol, a ketone, or an ether, a boiling point of the sealing solvent is 80° C. to 170° C., and in a case where the sealing solvent is an aromatic hydrocarbon, a boiling point of the sealing solvent is 150° C. to 170° C.

An object of the present invention is to provide a sealing method using a cover film where a problem of odor is not likely to occur and quick drying properties and sealability are high.

The sealing method according to the present invention is a sealing method that is performed using at least a cover film and a sealing solvent, the cover film including a polymer layer provided on a transparent support, in which the sealing solvent is a solvent including at least one kind selected from the group consisting of an ester, an alcohol, a ketone, an ether, and an aromatic hydrocarbon, in a case where the sealing solvent is an ester, an alcohol, a ketone, or an ether, a boiling point of the sealing solvent is 80° C. to 170° C., and in a case where the sealing solvent is an aromatic hydrocarbon, a boiling point of the sealing solvent is 150° C. to 170° C.

An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), in which the phenoxy resin (C) has an elastic modulus of 500 MPa or more at 25° C., a proportion of the phenoxy resin (C) in a total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60 mass%, a nanoindentation hardness at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 0.10 MPa or more, and the Young’s modulus at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 100 MPa or more; a film-like adhesive using the adhesive composition; and a semiconductor package using the film-like adhesive and a producing method thereof.

A temporary protective film for semiconductor encapsulation molding, the temporary protective film including a support film, an adhesive layer provided on one surface of the support film, and a non-adhesive layer provided on a surface of the support film on an opposite side from the surface provided with the adhesive layer. The thickness of the non-adhesive layer is 10 μm or less. A surface of the non-adhesive layer on an opposite side of a surface in contact with the support film, has a surface roughness Ra of 0.1 μm or more.

A temporary protective film for semiconductor encapsulation molding, the temporary protective film including a support film, an adhesive layer provided on one surface of the support film, and a non-adhesive layer provided on a surface of the support film on an opposite side from the surface provided with the adhesive layer. The thickness of the non-adhesive layer is 10 μm or less. A surface of the non-adhesive layer on an opposite side of a surface in contact with the support film, has a surface roughness Ra of 0.1 μm or more.

A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step. According to the method, a plurality of steps can be carried out while temporality fixing microstructures on a single donor substrate, and therefore it becomes possible to achieve the transfer of the microstructures with high efficiency without increasing the number of steps.

In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal is halogenated, as an arm-polymer, and a diacrylate-based compound or a dimethacrylate-based compound, as a cross-linker, and comprises a star polymer of a star-shape having a core/shell structure including a core formed by the polymerization of the cross-linker and a shell formed by a portion of the arm-polymer.