A multilayer adhesive tape is provided, including: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer sequentially. At least one of the first outer adhesive layer and the second outer adhesive layer includes a cured product of an outer adhesive composition including a high molecular weight prepolymer having a weight average molecular weight of 100,000 g/mol or more and 1,500,000 g/mol or less and a low molecular weight prepolymer having a weight average molecular weight of 1,000 g/mol or more and 80,000 g/mol or less.

A spacer tape is provided for spacing apart turns of a winding, which comprises a tape having an upper surface, a lower surface and a longitudinal axis, wherein the lower surface is adhesable and configured to be adhered to a conductor forming a turn of the winding, and spacers with an upper surface and a lower surface arranged on the tape, wherein the lower surface of the spacers is adhered to the upper surface of the tape, and wherein the upper surface of the spacers are adhesable and configured to be adhered to the conductor forming an adjacent turn of the winding.

A high-temperature-resistant insulating polymer composite is provided, including the following components in parts by mass: 3-12 parts of cyanate ester resin, 3-20 parts of epoxy resin, 5-15 parts of an inorganic filler, 0.1-2 parts of an epoxy resin curing agent, 0.0001-0.005 parts of a curing accelerant, and 0.1-2 parts of a dispersant. A glass transition temperature of the cured high-temperature-resistant insulating polymer composite is higher than 120° C.

The present invention aims to provide an adhesive tape capable of exhibiting excellent adhesion to rough surfaces. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing an acrylic copolymer, the acrylic copolymer containing 30% by weight or more of a structural unit derived from n-heptyl (meth)acrylate and 0.01% by weight or more and 30% by weight or less of a structural unit derived from 1-methylheptyl (meth)acrylate.

The present invention aims to provide an adhesive tape capable of exhibiting excellent adhesion to rough surfaces. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing an acrylic copolymer, the acrylic copolymer containing 30% by weight or more of a structural unit derived from n-heptyl (meth)acrylate and 0.01% by weight or more and 30% by weight or less of a structural unit derived from 1-methylheptyl (meth)acrylate.

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec-1 and measured at a temperature of 120° C., being 5.0×103 poise to 1.0×105 poise inclusive.

An adhesive composition includes a resin, a crosslinking agent, and a light absorber. The light absorber includes at least one selected from the group consisting of a benzophenone-based compound, a cyanoacrylate-based compound having a ring structure, a benzotriazole-based compound, and a sterically hindered amine compound having a ring structure.

Floor coverings having a greige good, an adhesive layer, and a secondary backing material. The greige good has a primary backing component having adjoined first and second portions, and a plurality of fibers. The secondary backing material has an attached portion and a first exposable portion, with the attached portion adhered to the first portion of the primary backing component by contact with the adhesive layer. The second portion of the primary backing component is unattached to the first exposable portion of the secondary backing material, and the first exposable portion defines a portion of the first end edge of the floor covering. The second portion of the primary backing component is selectively moveable relative to the first portion to a position in which at least a portion of the second portion of the primary backing component does not overlie the first exposable portion of the secondary backing material.

Floor coverings having a greige good, an adhesive layer, and a secondary backing material. The greige good has a primary backing component having adjoined first and second portions, and a plurality of fibers. The secondary backing material has an attached portion and a first exposable portion, with the attached portion adhered to the first portion of the primary backing component by contact with the adhesive layer. The second portion of the primary backing component is unattached to the first exposable portion of the secondary backing material, and the first exposable portion defines a portion of the first end edge of the floor covering. The second portion of the primary backing component is selectively moveable relative to the first portion to a position in which at least a portion of the second portion of the primary backing component does not overlie the first exposable portion of the secondary backing material.

A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.