A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.

A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.

A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.

A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of −20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.

A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of −20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

A bus bar, which includes a metal bar made of an electrically conductive metal material; a bandage member configured to surround the metal bar except for both ends of the metal bar; and an insulating tube configured to surround the metal bar and the bandage member together, wherein the bandage member is made of a metal wire having a surface coated with a coating material having insulation and fire resistance.

A bus bar, which includes a metal bar made of an electrically conductive metal material; a bandage member configured to surround the metal bar except for both ends of the metal bar; and an insulating tube configured to surround the metal bar and the bandage member together, wherein the bandage member is made of a metal wire having a surface coated with a coating material having insulation and fire resistance.

An adhesive film for a display includes a first adhesive layer including an adhesive resin; a water-vapor barrier layer disposed on the first adhesive layer; a second adhesive layer disposed on the water-vapor barrier layer and including an adhesive resin; and an optical film disposed on the second adhesive layer, wherein at least one layer of the first adhesive layer or the water-vapor barrier layer contains at least one tungsten oxide selected from a group consisting of cesium-doped tungsten oxide (CWO; cesium-doped WO.sub.3) and tungsten oxide (WO.sub.3).