The light reflective film has improved adhesive property between a light reflective layer and a hard coat layer. The light reflective film has a high refractive index layer, a low refractive index layer, a resin adhesive layer, and a hard coat layer laminated on a substrate, in this order. The hard coat layer has an active energy ray-curable resin. The resin adhesive layer has at least one resin selected from polyvinyl acetal resins, acrylic resins, and urethane resins.

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×10.sup.4 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×10.sup.3 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×10.sup.4 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×10.sup.3 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

A thermally conductive sheet includes: a first graphite sheet; a second graphite sheet that is any of a second graphite sheet disposed to entirely overlap the first graphite sheet, a second graphite sheet disposed to partially overlap and to be shifted from the first graphite sheet, and a second graphite sheet disposed such that there is an interval of less than 5 mm between the second graphite sheet and the first graphite sheet; a first adhesive layer configured to adhere facing surfaces of the first graphite sheet and the second graphite sheet which are disposed; metal layers stacked to sandwich the first graphite sheet and the second graphite sheet which are disposed from the top and bottom; and second adhesive layers configured to adhere facing surfaces of the first graphite sheet, the second graphite sheet, and the metal layers which are disposed.

The present invention is an optically clear, curable adhesive including a polyvinylbutyral, a polyurethane (meth)acrylate, and a photoinitiator. The polyvinylbutyral has a dynamic viscosity of between about 9 and about 13 mPa.Math.s and a polyvinyl alcohol weight percent of less than about 18%. The polyurethane (meth)acrylate includes the reaction product of a diol, at least one diisocyanate, and a hydroxyfunctional (meth)acrylate or an isocyanatofunctional (meth)acrylate. When the optically clear, curable adhesive is placed between two transparent substrates and made into a laminate, the laminate has a haze of less than about 6%, a transmission of greater than about 88% and an optical clarity of greater than about 98% when cured. The optically clear, curable adhesive also has a peel adhesion of at least about 100 g/cm based on ASTM 3330 when cured.

The present invention is an optically clear, curable adhesive including a polyvinylbutyral, a polyurethane (meth)acrylate, and a photoinitiator. The polyvinylbutyral has a dynamic viscosity of between about 9 and about 13 mPa.Math.s and a polyvinyl alcohol weight percent of less than about 18%. The polyurethane (meth)acrylate includes the reaction product of a diol, at least one diisocyanate, and a hydroxyfunctional (meth)acrylate or an isocyanatofunctional (meth)acrylate. When the optically clear, curable adhesive is placed between two transparent substrates and made into a laminate, the laminate has a haze of less than about 6%, a transmission of greater than about 88% and an optical clarity of greater than about 98% when cured. The optically clear, curable adhesive also has a peel adhesion of at least about 100 g/cm based on ASTM 3330 when cured.

The present invention aims to provide a filling-bonding material that is suitably used to fill a space between parts, while bonding the parts, in optical devices in various shapes not limited to flat shapes. The present invention also aims to provide a protective sheet-equipped filling-bonding material, a laminate, an optical device, and a protective panel for an optical device each including the filling-bonding material. Provided is a filling-bonding material having a shape with an uneven thickness.

The present invention aims to provide a filling-bonding material that is suitably used to fill a space between parts, while bonding the parts, in optical devices in various shapes not limited to flat shapes. The present invention also aims to provide a protective sheet-equipped filling-bonding material, a laminate, an optical device, and a protective panel for an optical device each including the filling-bonding material. Provided is a filling-bonding material having a shape with an uneven thickness.

The present invention aims to provide a filling-bonding material that is suitably used to fill a space between parts, while bonding the parts, in optical devices in various shapes not limited to flat shapes. The present invention also aims to provide a protective sheet-equipped filling-bonding material, a laminate, an optical device, and a protective panel for an optical device each including the filling-bonding material. Provided is a filling-bonding material having a shape with an uneven thickness.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.