Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

An interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant, which is excellent in followability to steps of a decorative printing portion or wiring upon filling of an interlayer space (lamination) and also excellent in defoaming properties to release air bubbles entrapped during filling of an interlayer space (lamination) or air bubbles left near the steps, which is less likely to be whitened and less likely to deteriorate an ITO film even under a high-temperature and high-humidity environment. The present invention also aims to provide a laminate produced using the interlayer filling material for a touch panel. The interlayer filling material includes: a polyvinyl acetal; a plasticizer; and an organic acid.

An interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant, which is excellent in followability to steps of a decorative printing portion or wiring upon filling of an interlayer space (lamination) and also excellent in defoaming properties to release air bubbles entrapped during filling of an interlayer space (lamination) or air bubbles left near the steps, which is less likely to be whitened and less likely to deteriorate an ITO film even under a high-temperature and high-humidity environment. The present invention also aims to provide a laminate produced using the interlayer filling material for a touch panel. The interlayer filling material includes: a polyvinyl acetal; a plasticizer; and an organic acid.

An interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant, which is excellent in followability to steps of a decorative printing portion or wiring upon filling of an interlayer space (lamination) and also excellent in defoaming properties to release air bubbles entrapped during filling of an interlayer space (lamination) or air bubbles left near the steps, which is less likely to be whitened and less likely to deteriorate an ITO film even under a high-temperature and high-humidity environment. The present invention also aims to provide a laminate produced using the interlayer filling material for a touch panel. The interlayer filling material includes: a polyvinyl acetal; a plasticizer; and an organic acid.

Radiation shielding glass articles with thin glass faceplates that improve transmission are disclosed. A radiation shielding glass article includes a radiation shielding glass having a first surface and an opposing second surface; and a first thin glass faceplate having a first surface and an opposing second surface, wherein one of said first surface or second surface of said first thin glass faceplate faces the first surface of the radiation shielding glass, wherein the first thin glass faceplate having a thickness of less than or equal to 1.0 mm is bonded to the first surface of the radiation shielding glass, and wherein the first thin glass faceplate is one of an alkaline boro-aluminosilicate glass, or a chemically strengthenable sodium aluminum silicate glass.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

An adhesive sheet includes cyclodextrin and a derivative polymer in which an alkyl group having a carbon number of 6 to 18 is introduced into a hydrophilic polymer, and at least a part of the alkyl group is in the form of inclusion with the cyclodextrin.

An adhesive sheet includes cyclodextrin and a derivative polymer in which an alkyl group having a carbon number of 6 to 18 is introduced into a hydrophilic polymer, and at least a part of the alkyl group is in the form of inclusion with the cyclodextrin.

Provided is an object forming liquid containing a resin containing at least one structural unit selected from the group consisting of a structural unit represented by a predetermined structural formula (1) and a structural unit represented by a predetermined structural formula (2), and an organic solvent, and substantially free of water. The object forming liquid is applied to a layer of a powder containing metal particles.