Provided herein are compositions and methods of preparing a liquid adhesive concentrate and a liquid adhesive formulation for use as an adhesive in installing insulation on the outside or inside surface of a duct or ductwork.

Provided herein are compositions and methods of preparing a liquid adhesive concentrate and a liquid adhesive formulation for use as an adhesive in installing insulation on the outside or inside surface of a duct or ductwork.

The invention relates to a curable volume expandable polymer composition comprising an organic acid component, wherein the organic acid component comprises a first organic acid, a second organic acid, and optionally one or more additional organic acids; wherein said polymer composition, when being heated to an activation of expansion temperature above room temperature, undergoes volume expansion. When the organic acid component is heated to the activation of expansion temperature, the first organic acid and/or the second organic acid and/or the optionally present one or more additional organic acids decarboxylate and thus release carbon dioxide. The polymer composition traps the thus released carbon dioxide thereby causing the polymer composition to undergo volume expansion.

The invention relates to a curable volume expandable polymer composition comprising an organic acid component, wherein the organic acid component comprises a first organic acid, a second organic acid, and optionally one or more additional organic acids; wherein said polymer composition, when being heated to an activation of expansion temperature above room temperature, undergoes volume expansion. When the organic acid component is heated to the activation of expansion temperature, the first organic acid and/or the second organic acid and/or the optionally present one or more additional organic acids decarboxylate and thus release carbon dioxide. The polymer composition traps the thus released carbon dioxide thereby causing the polymer composition to undergo volume expansion.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.

The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.