Disclosed are an organic barrier film, a preparation method of the organic barrier film, and a quantum dot device. The organic barrier film includes a substrate layer, an adhesive layer, and an oxygen barrier layer that are sequentially stacked. The oxygen barrier layer includes polyvinyl alcohol, and chemical cross-linking is formed between the adhesive layer and the oxygen barrier layer.

Disclosed is a method for improving interfacial adhesion of an adhesive to unprimed substrates and an improved adhesive composition, involving admixing an adhesive with an adhesive modifier, where the modifier is at least partially soluble in the at least one adhesive and includes either a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.

Disclosed is a method for improving interfacial adhesion of an adhesive to unprimed substrates and an improved adhesive composition, involving admixing an adhesive with an adhesive modifier, where the modifier is at least partially soluble in the at least one adhesive and includes either a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.

A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.

A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

Adhesive compositions are disclosed comprising acrylic copolymers formed from a monomer mixture comprising, based on the total weight of monomers in the monomer mixture, from 59 to 97.9 weight percent 2-ethylhexyl acrylate, from 0.1 to 10 weight percent styrene, from 0 to 25 weight percent methyl methacrylate, and from 2 to 30 weight percent ethyl acrylate, wherein the ratio of ethyl acrylate to styrene (by weight) is greater than 4.5 to 1. Methods for preparing adhesive compositions are disclosed comprising feeding an aqueous initial charge to a reactor, heating the aqueous initial charge to from about 30 to 110° C., gradually feeding a monomer mixture into the reactor over a period of time (less than 3 hours), in the presence of a free-radical polymerization initiator, thereby forming the acrylic adhesive composition, wherein the amount of free monomer in the reactor does not exceed 17 percent by weight, based on the total weight of the reactor contents, during gradual feeding.

Adhesive compositions are disclosed comprising acrylic copolymers formed from a monomer mixture comprising, based on the total weight of monomers in the monomer mixture, from 59 to 97.9 weight percent 2-ethylhexyl acrylate, from 0.1 to 10 weight percent styrene, from 0 to 25 weight percent methyl methacrylate, and from 2 to 30 weight percent ethyl acrylate, wherein the ratio of ethyl acrylate to styrene (by weight) is greater than 4.5 to 1. Methods for preparing adhesive compositions are disclosed comprising feeding an aqueous initial charge to a reactor, heating the aqueous initial charge to from about 30 to 110° C., gradually feeding a monomer mixture into the reactor over a period of time (less than 3 hours), in the presence of a free-radical polymerization initiator, thereby forming the acrylic adhesive composition, wherein the amount of free monomer in the reactor does not exceed 17 percent by weight, based on the total weight of the reactor contents, during gradual feeding.

The present invention relates to an adhesive composition comprising a polymer composition, lightened fillers, carbonate fillers; and a tackifying resin, and also to its use for applying a flexible surface covering to a substrate and to a corresponding bonding process.

The present invention relates to an adhesive composition comprising a polymer composition, lightened fillers, carbonate fillers; and a tackifying resin, and also to its use for applying a flexible surface covering to a substrate and to a corresponding bonding process.