Disclosed is a method for improving interfacial adhesion of an adhesive to unprimed substrates and an improved adhesive composition, involving admixing an adhesive with an adhesive modifier, where the modifier is at least partially soluble in the at least one adhesive and includes either a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.

Disclosed is a method for improving interfacial adhesion of an adhesive to unprimed substrates and an improved adhesive composition, involving admixing an adhesive with an adhesive modifier, where the modifier is at least partially soluble in the at least one adhesive and includes either a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.

The present invention is directed to tack solutions comprising formic acid, and their use in applying adhesive-coated films to substrates. In particular, paint protection films (PPFs) can be applied to vehicle bodies using the solutions of the present invention.

The present invention is directed to tack solutions comprising formic acid, and their use in applying adhesive-coated films to substrates. In particular, paint protection films (PPFs) can be applied to vehicle bodies using the solutions of the present invention.

An adhesive tape for bonding low-energy surfaces, comprising a UV cross-linked pressure-sensitive adhesive compound which comprises poly-acrylate, a linear or branched vinyl aromatic block co-polymer and at least one adhesive resin. The UV cross-linking of the pressure-sensitive adhesive compound is the result of irradiation with UV-A-containing light.

An adhesive tape for bonding low-energy surfaces, comprising a UV cross-linked pressure-sensitive adhesive compound which comprises poly-acrylate, a linear or branched vinyl aromatic block co-polymer and at least one adhesive resin. The UV cross-linking of the pressure-sensitive adhesive compound is the result of irradiation with UV-A-containing light.

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa.Math.s to 10.sup.7 Pa.Math.s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa.Math.s to 10.sup.7 Pa.Math.s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Provided are curable precursor compositions for pressure-sensitive adhesives and related articles, assemblies and methods. The provided compositions contain an alkyl (meth)acrylate, a hollow non-porous particulate filler, and a surface-modifying agent comprising a hydrophobic alkoxy silane or hydrophobic organofunctional polysiloxane. These compositions and methods enable in situ functionalization of the filler particles during or after the time they are combined with the curable resin components, thereby allowing pressure-sensitive adhesive materials to be made faster and more efficiently than when using conventional manufacturing methods.

Provided are curable precursor compositions for pressure-sensitive adhesives and related articles, assemblies and methods. The provided compositions contain an alkyl (meth)acrylate, a hollow non-porous particulate filler, and a surface-modifying agent comprising a hydrophobic alkoxy silane or hydrophobic organofunctional polysiloxane. These compositions and methods enable in situ functionalization of the filler particles during or after the time they are combined with the curable resin components, thereby allowing pressure-sensitive adhesive materials to be made faster and more efficiently than when using conventional manufacturing methods.