ORGANIC ELECTRONIC DEVICE INCLUDING ENCAPSULATION LAYER

Abstract

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa.Math.s to 10.sup.7 Pa.Math.s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Claims

1. An organic electronic device, comprising: a substrate; an organic electronic element formed on the substrate; and an encapsulation film encapsulating the organic electronic element, wherein the organic electronic element comprises a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode, wherein the light emitting organic material layer comprises a hole transport layer, an emitting layer and an electron transport layer, wherein the encapsulation film comprises a pressure-sensitive adhesive layer comprising a pressure-sensitive adhesive composition or a crosslinked product thereof, wherein the pressure-sensitive adhesive composition comprises a polymer derived from butylene, and wherein the pressure-sensitive adhesive composition has a Mooney viscosity (η*) of 5000 Pa.Math.s to 10.sup.7 Pa.Math.s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

2. The organic electronic device of claim 1, wherein the pressure-sensitive adhesive composition further comprises: a compound of Formula 1, ##STR00004## wherein T is a linear or branched alkyl group, alkenyl group or alkynyl group having 6 to 30 carbon atoms, or —U—[O—W].sub.n—O-Q, in which U and W are each independently an alkylene group or alkylidene group, Q is an alkyl group, alkenyl group, alkynyl group or aryl group, and n is a number from 0 to 10.

3. The organic electronic device of claim 1, wherein the polymer derived from butylene is a homopolymer of a butylene monomer; a copolymer of a butylene monomer and a monomer capable of being polymerized with the butylene monomer; a reactive oligomer obtained from a butylene monomer; or a mixture thereof.

4. The organic electronic device of claim 3, wherein the monomer capable of being polymerized with a butylene monomer is isoprene, styrene or butadiene.

5. The organic electronic device of claim 3, wherein the reactive oligomer obtained from a butylene monomer comprises a butylene polymer having a reactive functional group, and the butylene polymer binds to a different polymer having a reactive functional group.

6. The organic electronic device of claim 2, wherein the pressure-sensitive adhesive composition comprises the polymer derived from butylene in an amount of 60 to 95 parts by weight, and the compound of Formula 1 in an amount of 5 to 40 parts by weight.

7. The organic electronic device of claim 2, wherein the pressure-sensitive adhesive composition further comprises a multifunctional active energy ray polymerizable compound of Formula 2, ##STR00005## wherein R.sub.1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or higher, and X is a residue derived from a linear, branched or cyclic alkyl group having 3 to 30 carbon atoms.

8. The organic electronic device of claim 7, wherein the pressure-sensitive adhesive composition comprises the polymer derived from butylene in an amount of 50 to 90 parts by weight, the compound of Formula 1 in an amount of 5 to 35 parts by weight, and the multifunctional active energy ray polymerizable compound of Formula 2 in an amount of 5 to 25 parts by weight.

9. The organic electronic device of claim 2, wherein the pressure-sensitive adhesive composition further comprises a tackifier.

10. The organic electronic device of claim 9, wherein the tackifier is a hydrogenated cyclic olefin-based polymer.

11. The organic electronic device of claim 9, wherein the pressure-sensitive adhesive composition comprises the tackifier in an amount of 5 to 100 parts by weight with respect to 100 parts by weight of the polymer.

12. The organic electronic device of claim 2, wherein the pressure-sensitive adhesive composition further comprises a radical initiator.

13. The organic electronic device of claim 12, wherein the radical initiator is a photoinitiator or thermal initiator.

14. The organic electronic device of claim 2, wherein the pressure-sensitive adhesive composition further comprises a moisture scavenger.

15. The organic electronic device of claim 1, wherein the pressure-sensitive adhesive layer includes a first layer comprising a pressure-sensitive adhesive resin or an adhesive resin and a second layer comprising the pressure-sensitive adhesive composition or a crosslinked product thereof.

16. The organic electronic device of claim 15, wherein the encapsulation film further comprises a metal layer formed on a surface of the pressure-sensitive adhesive layer.

17. The organic electronic device of claim 16, wherein the metal layer is formed on the first layer of the pressure-sensitive adhesive layer.

18. The organic electronic device of claim 16, wherein the metal layer has a thermal conductivity of 50 W/mK or more.

19. The organic electronic device of claim 1, wherein the pressure-sensitive adhesive layer has a water vapor transmission rate (WVTR) in a thickness direction of 50 g/m.sup.2.Math.day or less, while formed to a thickness of 100 μm.

20. A method of manufacturing the organic electronic device of claim 1, wherein the method comprises: forming the organic electronic element on the substrate, applying the encapsulation film to the substrate on which the organic electronic element is formed; and curing the encapsulation film, wherein the encapsulation film covers entire surfaces of the organic electronic element.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0093] FIGS. 1 and 2 are cross-sectional views of an encapsulation film according to an exemplary embodiment of the present application; and

[0094] FIG. 3 is a cross-sectional view of an OED according to an exemplary embodiment of the present application.

EXPLANATION OF REFERENCE NUMERALS

[0095] 11: base film or release film [0096] 12: pressure-sensitive adhesive layer [0097] 12a: first layer [0098] 12b: second layer [0099] 13: metal layer [0100] 21: substrate [0101] 22: organic electronic device

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0102] Hereinafter, the present application will be described in further detail with reference to examples according to the present application and comparative examples not according to the present application, and the scope of the present application is not limited to the following examples.

Example 1

[0103] A coating solution was prepared by adding 50 g of butyl rubber (Br068, EXXON) as a polymer derived from butylene, 24 g of a hydrogenated hydrocarbon resin (Eastotac H-100L) as a tackifier, 15 g of trimethylolpropane triacrylate as a multifunctional active energy ray polymerizable compound, and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure 651, Ciba) as a radical initiator, and diluting the resultant mixture with toluene to have a solid content of about 15 wt %.

[0104] An encapsulation film was formed by forming a pressure-sensitive adhesive layer to a thickness of 50 μm by coating a release surface of a release PET with the prepared solution and drying the coated product in an oven at 100° C. for 15 minutes, and laminating the pressure-sensitive adhesive layer with a copper film having a thickness of 20 μm. The film sample was irradiated with UV rays at 2 J/cm.sup.2 to measure physical properties.

Example 2

[0105] An encapsulation film was formed by the same method as described in Example 1, except that 10 g of a multifunctional active energy ray polymerizable compound was added.

Example 3

[0106] An encapsulation film was formed by the same method as described in Example 1, except that 10 g of trimethylolpropane triacrylate as a multifunctional active energy ray polymerizable compound and 15 g of a monofunctional acrylate, i.e., 2-(2-ethoxyethoxy)ethyl acrylate as the compound of Formula 1 were added.

Comparative Example 1

[0107] 200 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical Co. Ltd.) and 150 g of a phenoxy resin (YP-50, Tohto Kasei Co. Ltd.) were added to a reactor at room temperature, and the resultant mixture was diluted with methylethylketone. A coating solution was prepared by adding 4 g of imidazole (Shikoku Kasei Co. Ltd.) as a curing agent to the homogenized solution, and stirring the resultant solution at a high speed for 1 hour.

[0108] The prepared solution was applied to the releasing surface of a release PET, and dried in an oven at 100° C. for 15 minutes, thereby forming a pressure-sensitive adhesive layer having a thickness of 50 μm, and then the pressure-sensitive adhesive layer was laminated with a copper film having a thickness of 20 μm, resulting in an encapsulation film. The film sample was irradiated with UV rays at 2 J/cm.sup.2 to measure physical properties.

Comparative Example 2

[0109] A coating solution was prepared by adding 50 g of butyl rubber (Br068, EXXON) as a polymer derived from butylene, 24 g of a hydrogenated hydrocarbon resin (Eastotac H-100L) as a tackifier, 15 g of a monofunctional acrylate, i.e., stearyl acrylate, and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure 651, Ciba) as a radical initiator, and diluting the resultant mixture with toluene to have a solid content of about 15 wt %.

[0110] An encapsulation film was formed by forming a pressure-sensitive adhesive layer to a thickness of 50 μm by coating a release surface of a release PET with the prepared solution and drying the coated product in an oven at 100° C. for 15 minutes, and laminating the pressure-sensitive adhesive layer with a copper film having a thickness of 20 μm. The film sample was irradiated with UV rays at 2 J/cm.sup.2 to measure physical properties.

Comparative Example 3

[0111] An encapsulation film was manufactured by the same method as described in Example 1, except that 60 g of butyl rubber (Br068, EXXON) as a polymer derived from butylene, 20 g of a hydrogenated hydrocarbon resin (Eastotac H-100L) as a tackifier, and 32 g of trimethylolpropane triacrylate as a multifunctional active energy ray polymerizable compound were added.

Experimental Example 1—Measurement of Viscosity

[0112] The Mooney viscosity of the pressure-sensitive adhesive prepared in each of Examples and Comparative Examples was measured through ARES produced by TA. The Mooney viscosity was measured according to a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and a temperature of 30° C., and additionally measured at 100° C.

Experimental Example 2—Tool Fouling and Panel Laminating Property

[0113] The pressure-sensitive adhesive layer having a thickness of 50 μm and a size of 14 cm×9 cm, which was formed in any one of Examples and Comparative Examples, was attached to the center of a 0.7T glass having a size of 150 cm×10 cm using a roll laminator. A glass having the same size as the prepared specimen was laminated by vertical pressing using a vacuum laminator at 25 to 100° C. and a vacuum degree of 100 pa under a pressure of 0.5 MPa.

[0114] A laminating property was determined by the degree of non-lamination or bubble generation on the entire surfaces of a pressure-sensitive adhesive, and thus when non-lamination or generation of at least one bubble having a diameter of 3 mm or more occurred, it was determined as a lamination failure.

[0115] Also, when the pressure-sensitive adhesive layer having a size of 14 cm×9 cm was laminated, and spilled on a side surface 300 μm away from the original size, a tool was fouled in a panel process.

TABLE-US-00001 TABLE 1 Panel 30° C. viscosity 100° C. viscosity Tool laminating (Pa .Math. s) (Pa .Math. s) fouling property Example 1  7,000 5,200 No Excellent Example 2  12,000 980 No Excellent Example 3 170,000 150,000 No Excellent Comparative 1.8 × 10.sup.7 700 Yes Lamination Example 1 failed Comparative 2.5 × 10.sup.7 400 Yes Excellent Example 2 Comparative 2.5 × 10.sup.7 2.5 × 10.sup.7 No Lamination Example 3 failed