A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa.Math.s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.

An image display panel is disclosed with a bezel including an image display unit and a polarizing film provided on a viewing side of the image display unit via a pressure-sensitive adhesive layer; and a narrow-frame external bezel provided via an elastic intermediate layer, wherein a distance from the viewing-side outermost surface of the image display panel to the pressure-sensitive adhesive layer is 75 μm or more, and the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition including a (meth)acrylic polymer (A) containing 80 mass % or more of a prescribed monomer (a) as a monofunctional monomer unit and 20 mass % or more of n-butyl acrylate or 70 mass % or more of an alkoxyalkyl (meth)acrylate are contained as the prescribed monomer (a), and a silane coupling agent (B), not containing polyether compound having a polyether skeleton and a reactive silyl group.

A pressure-sensitive adhesive layer attached optical film is disclosed, including a one-side-protected polarizing film including a thin polarizer and a transparent protective film (excluding a retardation film) on one surface of the polarizer, and the pressure-sensitive adhesive layer is provided on a side of the one-side-protected polarizing film on which the transparent protective film is not provided, and the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition including a (meth)acrylic polymer (A) containing 80 mass % or more of a prescribed monomer (a) as a monofunctional monomer unit and 20 mass % or more of n-butyl acrylate or 70 mass % or more of an alkoxyalkyl (meth)acrylate are contained as the prescribed monomer (a), and a silane coupling agent (B), not containing polyether compound having a polyether skeleton and a reactive silyl group.

A polyvinyl chloride adhesive tape includes a substrate, a primer layer, and an adhesive layer. The substrate contains a polyvinyl chloride and a plasticizer. The primer layer is disposed under the substrate. The adhesive layer is disposed under the primer layer and contains a resin component having 20% by mass or more of acrylic polymer. The plasticizer contained in the substrate is at least one plasticizer selected from the group consisting of trimellitic acid-based plasticizers, aliphatic dibasic acid-based plasticizers, epoxy-based plasticizers, phthalic acid-based plasticizers, pyromellitic acid ester-based plasticizers, phosphate ester-based plasticizers, and ether ester-based plasticizers.

A polyvinyl chloride adhesive tape includes a substrate, a primer layer, and an adhesive layer. The substrate contains a polyvinyl chloride and a plasticizer. The primer layer is disposed under the substrate. The adhesive layer is disposed under the primer layer and contains a resin component having 20% by mass or more of acrylic polymer. The plasticizer contained in the substrate is at least one plasticizer selected from the group consisting of trimellitic acid-based plasticizers, aliphatic dibasic acid-based plasticizers, epoxy-based plasticizers, phthalic acid-based plasticizers, pyromellitic acid ester-based plasticizers, phosphate ester-based plasticizers, and ether ester-based plasticizers.

Described herein is an adhesive composition comprising: (a) a (meth)acryloyl polymer; and (b) greater than 1 parts of a tackifier per 100 parts of the(meth)acryloyl polymer, wherein the tackifier comprises a substituted oligomeric quinoline.

The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

The present invention provides an adhesive film hardly suffering from fisheyes and deposition of dirt and dusts thereonto and having excellent mechanical strength and heat resistance as well as good adhesion properties, which can be suitably used as various surface protective films, etc. The present invention relates to an adhesive film comprising a polyester film and an adhesive layer formed on at least one surface of the polyester film, in which the adhesive layer comprises a resin having a glass transition point of not higher than 0° C., and an antistatic agent, and a thickness of the adhesive layer is not more than 10 μm.

A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.