An aqueous cross-linkable copolymer dispersion is formed by emulsion polymerization of a monomer mixture comprising at least one ethylenically unsaturated main monomer and at least one 1,3-dicarbonyl functionalized monomer and lysine or a salt thereof.

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

Provided are an adhesive composition having enhanced reliability at edge portions of a display apparatus and the display apparatus, the display apparatus including a display panel displaying an image to the outside, a cover window arranged on the display panel, and an adhesive layer interposed between the display panel and the cover window, the adhesive layer including an adhesive composition including (meth)acrylate having an alicyclic group, a low-temperature glass transition (meth)acrylic monomer, (meth)acrylate having a hydroxyl group, a high-temperature glass transition (meth)acrylic monomer, and a reactive diluent monomer, in which a maximum value of stress of the adhesive composition, with the stress changing over time when a strain of 25% is applied at 60° C. to the adhesive layer, is from about 30000 Pa to about 40000 Pa.

Disclosed are an organic barrier film, a preparation method of the organic barrier film, and a quantum dot device. The organic barrier film includes a substrate layer, an adhesive layer, and an oxygen barrier layer that are sequentially stacked. The oxygen barrier layer includes polyvinyl alcohol, and chemical cross-linking is formed between the adhesive layer and the oxygen barrier layer.

Disclosed are an organic barrier film, a preparation method of the organic barrier film, and a quantum dot device. The organic barrier film includes a substrate layer, an adhesive layer, and an oxygen barrier layer that are sequentially stacked. The oxygen barrier layer includes polyvinyl alcohol, and chemical cross-linking is formed between the adhesive layer and the oxygen barrier layer.

A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

Embodiments provide an apparel product. The apparel product includes a major component forming a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The apparel product includes a minor component forming a secondary portion configured to be coupled to the major component. An adhesive is disposed at least partially between a portion of the major component and a portion of the minor component. The adhesive includes a shape memory material.

Embodiments provide an apparel product. The apparel product includes a major component forming a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The apparel product includes a minor component forming a secondary portion configured to be coupled to the major component. An adhesive is disposed at least partially between a portion of the major component and a portion of the minor component. The adhesive includes a shape memory material.