A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.

A polycarbonate polyfunctional-vinyl ether molecule of formula (I):

##STR00001##

A polycarbonate polyfunctional-vinyl ether molecule of formula (I):

##STR00001##

A polymerizable system includes a curable composition and one or more encapsulated initiator particles. The curable composition can include one or more 1,1-disubstituted alkene compounds and the encapsulated initiator particles can include one or more polymerization initiators encapsulated by a cured composition. The cured composition includes one or more 1,1-disubstituted alkene compounds.

A polymerizable system includes a curable composition and one or more encapsulated initiator particles. The curable composition can include one or more 1,1-disubstituted alkene compounds and the encapsulated initiator particles can include one or more polymerization initiators encapsulated by a cured composition. The cured composition includes one or more 1,1-disubstituted alkene compounds.

A polymerizable system includes a curable composition and one or more encapsulated initiator particles. The curable composition can include one or more 1,1-disubstituted alkene compounds and the encapsulated initiator particles can include one or more polymerization initiators encapsulated by a cured composition. The cured composition includes one or more 1,1-disubstituted alkene compounds.

A curable resin composition for forming an adhesive layer on at least one surface of a substrate (C), the curable resin composition comprising: a compound (A) represented by formula (1): ##STR00001##
wherein X represents a functional group containing a reactive group, and R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an optionally substituted, aliphatic hydrocarbon, aryl, or heterocyclic group; and an adhesion aid compound (B), the curable resin composition satisfying formula (X): 10HSP (A)HSP (B)10 and formula (Y): 10HSP (C)HSP (B)10, wherein HSP (A) is an HSP value of the compound (A), HSP (B) is an HSP value of the adhesion aid compound (B), and HSP (C) is an HSP value of the substrate (C).

A curable resin composition for forming an adhesive layer on at least one surface of a substrate (C), the curable resin composition comprising: a compound (A) represented by formula (1): ##STR00001##
wherein X represents a functional group containing a reactive group, and R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an optionally substituted, aliphatic hydrocarbon, aryl, or heterocyclic group; and an adhesion aid compound (B), the curable resin composition satisfying formula (X): 10HSP (A)HSP (B)10 and formula (Y): 10HSP (C)HSP (B)10, wherein HSP (A) is an HSP value of the compound (A), HSP (B) is an HSP value of the adhesion aid compound (B), and HSP (C) is an HSP value of the substrate (C).

A method is for manufacturing a laminated steel sheet comprising laminated a predetermined number of thin steel sheets formed by punching a belt-shaped thin steel sheet into a predetermined shape. This method includes the following steps 1 to 3: step 1: a step of sequentially punching the thin steel sheet into a predetermined shape with a metallic die; step 2: a step of applying a curable composition to a predetermined portion of the thin steel sheet; and step 3: a step of irradiating the curable composition with energy rays. The curable composition is a delayed curable composition which is cured after a lapse of a predetermined time after being irradiated with energy rays.