An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

An object of the present invention is to provide a two-part composition containing a first agent and a second agent: the first agent comprising (1) (meth)acrylate and (2) organoboron compound, and having an oxygen content of 5 ppm or less, and the second agent comprising (3) phosphate ester.

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa.Math.s to 10.sup.7 Pa.Math.s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa.Math.s to 10.sup.7 Pa.Math.s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Compositions which are curable by, for example, exposure to radiation to form useful articles such as three-dimensionally printed objects are prepared using multistage polymers, polymerizing organic substances and (meth)acrylic polymers. The multistage polymer is effective to toughen and impact modify the cured articles, yet the compositions prior to curing are relatively low in viscosity and agglomerate content even at high loadings of multistage polymer.

Compositions which are curable by, for example, exposure to radiation to form useful articles such as three-dimensionally printed objects are prepared using multistage polymers, polymerizing organic substances and (meth)acrylic polymers. The multistage polymer is effective to toughen and impact modify the cured articles, yet the compositions prior to curing are relatively low in viscosity and agglomerate content even at high loadings of multistage polymer.

Provided is a method for producing a chloroprene graft copolymer latex containing no organic solvent and exhibiting high adhesive strength even for soft polyvinyl chloride. A method for producing a chloroprene graft copolymer latex includes a chloroprene polymerization step of giving a chloroprene polymer latex and a graft copolymerization step of giving a chloroprene graft copolymer latex. The chloroprene polymerization step is a step of subjecting at least chloroprene (A-1) of chloroprene (A-1) and a monomer (A-2) copolymerizable with chloroprene (A-1) to emulsion radical polymerization. The graft copolymerization step is a step of adding, to the chloroprene polymer latex, a (meth)acrylate (B) and an organic peroxide (C) having an octanol/water partition coefficient of −2.0 or more and 3.0 or less to subject the chloroprene polymer to graft copolymerization with the (meth)acrylate (B) at a temperature of 10° C. or more and 40° C. or less.