Patent classifications
C09J155/04
Assembly of timepiece parts assembled using repositionable hot melt adhesive and process for assembling and repositioning such parts
An assembly of timepiece parts assembled together with an adhesive at a temperature T.sub.A and to be repositioned when the adhesive is at a temperature T.sub.C. The adhesive includes a formulation, which at T.sub.C includes a mixture of polymer chains with pendant diene units X and coupling molecules including two dienophile end groups Y, wherein the X units and the Y groups are arranged to react with one another and to bond together with the Diels-Alder reaction at a temperature T.sub.DA and to regenerate with the retro-Diels-Alder reaction at a temperature T.sub.RDA, at T.sub.A forms a three-dimensional network, in which the polymer chains are linked to one another by the coupling molecules with the Diels-Alder reaction, where T.sub.A<T.sub.RDAT.sub.C, where temperature T.sub.DA ranges between 0 C. and 100 C. and temperature T.sub.RDA ranges between 50 C. and 200 C., and T.sub.DA is strictly lower than T.sub.RDA. A process for assembling and repositioning two timepiece parts with a repositionable hot melt adhesive to enable the timepiece parts to be repositioned when the adhesive is heated.
Assembly of timepiece parts assembled using repositionable hot melt adhesive and process for assembling and repositioning such parts
An assembly of timepiece parts assembled together with an adhesive at a temperature T.sub.A and to be repositioned when the adhesive is at a temperature T.sub.C. The adhesive includes a formulation, which at T.sub.C includes a mixture of polymer chains with pendant diene units X and coupling molecules including two dienophile end groups Y, wherein the X units and the Y groups are arranged to react with one another and to bond together with the Diels-Alder reaction at a temperature T.sub.DA and to regenerate with the retro-Diels-Alder reaction at a temperature T.sub.RDA, at T.sub.A forms a three-dimensional network, in which the polymer chains are linked to one another by the coupling molecules with the Diels-Alder reaction, where T.sub.A<T.sub.RDAT.sub.C, where temperature T.sub.DA ranges between 0 C. and 100 C. and temperature T.sub.RDA ranges between 50 C. and 200 C., and T.sub.DA is strictly lower than T.sub.RDA. A process for assembling and repositioning two timepiece parts with a repositionable hot melt adhesive to enable the timepiece parts to be repositioned when the adhesive is heated.
ASSEMBLY OF TIMEPIECE PARTS ASSEMBLED USING REPOSITIONABLE HOT MELT ADHESIVE AND PROCESS FOR ASSEMBLING AND REPOSITIONING SUCH PARTS
An assembly of timepiece parts assembled together with an adhesive at a temperature T.sub.A and to be repositioned when the adhesive is at a temperature T.sub.C. The adhesive includes a formulation, which at T.sub.C includes a mixture of polymer chains with pendant diene units X and coupling molecules including two dienophile end groups Y, wherein the X units and the Y groups are arranged to react with one another and to bond together with the Diels-Alder reaction at a temperature T.sub.DA and to regenerate with the retro-Diels-Alder reaction at a temperature T.sub.RDA, at T.sub.A forms a three-dimensional network, in which the polymer chains are linked to one another by the coupling molecules with the Diels-Alder reaction, where T.sub.A<T.sub.RDAT.sub.C, where temperature T.sub.DA ranges between 0 C. and 100 C. and temperature T.sub.RDA ranges between 50 C. and 200 C., and T.sub.DA is strictly lower than T.sub.RDA. A process for assembling and repositioning two timepiece parts with a repositionable hot melt adhesive to enable the timepiece parts to be repositioned when the adhesive is heated.