C09J159/04

CURABLE COMPOSITION, CURED PRODUCT, AND ADHESIVE

Provided are a curable composition, a cured product thereof, and an adhesive. The curable composition contains a blocked isocyanate prepolymer (A) formed from a polyol compound (a1), a polyisocyanate compound (a2), and a blocking agent (a3) as essential raw materials, an epoxy resin (B), and a curing agent (C). The blocking agent (a3) contains a phenol compound having a hydrocarbon group having 12 or more carbon atoms. The curable composition has excellent adhesive properties and resistance to humidity and heat, and can be suitably used for an adhesive and the like.

CURABLE COMPOSITION, CURED PRODUCT, AND ADHESIVE

Provided are a curable composition, a cured product thereof, and an adhesive. The curable composition contains a blocked isocyanate prepolymer (A) formed from a polyol compound (a1), a polyisocyanate compound (a2), and a blocking agent (a3) as essential raw materials, an epoxy resin (B), and a curing agent (C). The blocking agent (a3) contains a phenol compound having a hydrocarbon group having 12 or more carbon atoms. The curable composition has excellent adhesive properties and resistance to humidity and heat, and can be suitably used for an adhesive and the like.

Polyacetal resin composition, composite molding using the same, and method for producing the same

The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190 C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190 C. and 2.16 kg load is 2.5 g/10 minutes or less.

Polyacetal resin composition, composite molding using the same, and method for producing the same

The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190 C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190 C. and 2.16 kg load is 2.5 g/10 minutes or less.

Polyacetal resin composition, composite molding using the same, and method for producing the same

The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190 C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190 C. and 2.16 kg load is 2.5 g/10 minutes or less.