Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.

Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.

Disclosed is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin essentially including at least a 4-amino-3-methylphenol-type epoxy resin; and (C) a latent curing agent. Preferably, the cyanate ester resin (A) is at least one selected from the group consisting of compounds represented by formula (1) below, compounds represented by formula (2) below, and at least one of polymer of these compounds. Formula (1): NCO-A.sup.1-Y.sup.1-A.sup.2-OCN (See the Description for the symbols in the formula). Formula (2): (See the Description for the symbols in the formula).

Disclosed is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin essentially including at least a 4-amino-3-methylphenol-type epoxy resin; and (C) a latent curing agent. Preferably, the cyanate ester resin (A) is at least one selected from the group consisting of compounds represented by formula (1) below, compounds represented by formula (2) below, and at least one of polymer of these compounds. Formula (1): NCO-A.sup.1-Y.sup.1-A.sup.2-OCN (See the Description for the symbols in the formula). Formula (2): (See the Description for the symbols in the formula).

A curing resin composition including (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen-containing amine latent curing agent, and (D) an ion scavenger. The cyanate ester resin (A) is preferably at least one of a compound of formula (1) below, a compound of formula (2) below, and a polymer of at least one of these compounds (1) and (2).

NCO-A.sup.1-Y.sup.1-A.sup.2-OCN(1) wherein the symbols are as defined in the description.

##STR00001## wherein the symbols are as defined in the description.

A curing resin composition including (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen-containing amine latent curing agent, and (D) an ion scavenger. The cyanate ester resin (A) is preferably at least one of a compound of formula (1) below, a compound of formula (2) below, and a polymer of at least one of these compounds (1) and (2).

NCO-A.sup.1-Y.sup.1-A.sup.2-OCN(1) wherein the symbols are as defined in the description.

##STR00001## wherein the symbols are as defined in the description.

An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/ C. from a temperature 10 C. higher than a minimum melt viscosity attainment temperature to a temperature 10 C. higher than the temperature.