The present disclosure relates to rubber polymers of ethylene-glycidylmethacrylate-vinyl acetate polymer as modifiers in epoxy resins. In particular ethylene-glycidylmethacrylate-vinyl acetate rubber polymers comprising phthalic anhydride modified glycidyl methacrylate monomer units.

The present disclosure relates to rubber polymers of ethylene-glycidylmethacrylate-vinyl acetate polymer as modifiers in epoxy resins. In particular ethylene-glycidylmethacrylate-vinyl acetate rubber polymers comprising phthalic anhydride modified glycidyl methacrylate monomer units.

Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.

A frame glue material, a display panel, and a manufacturing method thereof are disclosed. The frame glue material includes a photoinitiator, a thermal curing agent, and an epoxy acrylate resin, and a chemical structural formula of the epoxy acrylate resin is:

##STR00001##

wherein, R includes at least one of resorcinol, hydroquinone, or bisphenol A.

A frame glue material, a display panel, and a manufacturing method thereof are disclosed. The frame glue material includes a photoinitiator, a thermal curing agent, and an epoxy acrylate resin, and a chemical structural formula of the epoxy acrylate resin is:

##STR00001##

wherein, R includes at least one of resorcinol, hydroquinone, or bisphenol A.

The present invention aims to provide an adhesive composition capable of suppressing shrinkage on curing and excellent in storage stability and depth curability, or an adhesive composition excellent in adhesion on photocuring, curability by heating at low temperature, and low shrinkability on curing. The present invention also aims to provide an optical component, an electronic component, and an electronic module each including the adhesive composition. Provided is an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a radical scavenger, the polymerizable compound including a (meth)acrylic compound and a vinyl group-containing cyclic amide compound, the vinyl group-containing cyclic amide compound being contained in an amount of 20 parts by weight or more and 150 parts by weight or less relative to 100 parts by weight of the (meth)acrylic compound, or an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a heat curing agent, the polymerizable compound including a radical polymerizable compound containing no epoxy group, an epoxy compound containing no radical polymerizable group, and a compound containing an epoxy group and a radical polymerizable group, the heat curing agent including a heat curing agent having a lowest value of a starting range temperature of 80° C. or lower.

The present invention aims to provide an adhesive composition capable of suppressing shrinkage on curing and excellent in storage stability and depth curability, or an adhesive composition excellent in adhesion on photocuring, curability by heating at low temperature, and low shrinkability on curing. The present invention also aims to provide an optical component, an electronic component, and an electronic module each including the adhesive composition. Provided is an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a radical scavenger, the polymerizable compound including a (meth)acrylic compound and a vinyl group-containing cyclic amide compound, the vinyl group-containing cyclic amide compound being contained in an amount of 20 parts by weight or more and 150 parts by weight or less relative to 100 parts by weight of the (meth)acrylic compound, or an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a heat curing agent, the polymerizable compound including a radical polymerizable compound containing no epoxy group, an epoxy compound containing no radical polymerizable group, and a compound containing an epoxy group and a radical polymerizable group, the heat curing agent including a heat curing agent having a lowest value of a starting range temperature of 80° C. or lower.

A stress relaxation type adhesive is formed such that an epoxy-based base adhesive is formed with an epoxy compound having two or more allyl groups as functional groups, as a main agent, using an amine-based curing agent having a bisphenol A type resin backbone, and at least one of an ethylene-acrylic copolymer and an ethylene-propylene copolymer each having an average particle diameter of 10 μm or less is contained as a stress relaxation agent in a range of 20 wt % or less with respect to the base adhesive.

A stress relaxation type adhesive is formed such that an epoxy-based base adhesive is formed with an epoxy compound having two or more allyl groups as functional groups, as a main agent, using an amine-based curing agent having a bisphenol A type resin backbone, and at least one of an ethylene-acrylic copolymer and an ethylene-propylene copolymer each having an average particle diameter of 10 μm or less is contained as a stress relaxation agent in a range of 20 wt % or less with respect to the base adhesive.

Curable polymeric compositions with improved barrier property to oxygen suitable to be used on flexible substrates containing a bisphenol F epoxy resin, at least an epoxy acrylate component and at least a rubber modified bisphenol and further comprising EVOH capsules or beads dispersed therein. The polymeric compositions are applicable either by a melt or liquid coating technique and undergo curing upon exposure to heat, showing viscoelastic properties and suitable to provide a cured product having high durability.