The present invention relates to a kneadable adhesive sealant composition comprising a first outer portion of a first material comprising an uncured reactive polymer or resin composition and a second inner portion of a second material comprising a curing agent capable of curing the uncured reactive polymer or resin composition, wherein the first portion substantially surrounds the second portion and a process for making the same.

Provided are flux-compatible epoxy-phenol adhesive compositions useful as a low gap underfill and novel phenols useful therein. The flux-compatible epoxy-phenol adhesive compositions include an epoxy component including an epoxy compound having a cycloaliphatic, alicyclic or mixed cycloaliphatic-aromatic backbone, a multifunctional phenolic component, and a catalyst. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

Provided are flux-compatible epoxy-phenol adhesive compositions useful as a low gap underfill and novel phenols useful therein. The flux-compatible epoxy-phenol adhesive compositions include an epoxy component including an epoxy compound having a cycloaliphatic, alicyclic or mixed cycloaliphatic-aromatic backbone, a multifunctional phenolic component, and a catalyst. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

The present invention relates to an adhesive composition and an organic electronic device comprising the same, and provides an adhesive composition which can form a encapsulating structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, and can improve processability by being easily applied in the process of forming the encapsulating structure of the organic electronic device, thereby preventing problems that air bubbles flow into the inside of the encapsulating structure or application nozzles are clogged, and an organic electronic device comprising the same.

A polarizing plate for light emitting displays and a light emitting display including the same are provided. A polarizing plate includes: a polarizer; and a first liquid crystal retardation film, a first bonding layer, and a second liquid crystal retardation film sequentially stacked on a surface of the polarizer, and the first bonding layer has a glass transition temperature of about 70 C. to about 100 C. and is formed of a composition including at least one selected from among an alicyclic group-containing glycidyl ether and an aromatic group-containing glycidyl ether.

A polarizing plate for light emitting displays and a light emitting display including the same are provided. A polarizing plate includes: a polarizer; and a first liquid crystal retardation film, a first bonding layer, and a second liquid crystal retardation film sequentially stacked on a surface of the polarizer, and the first bonding layer has a glass transition temperature of about 70 C. to about 100 C. and is formed of a composition including at least one selected from among an alicyclic group-containing glycidyl ether and an aromatic group-containing glycidyl ether.

The present invention relates to a camera module, comprising: a lens barrel including a body part, and an extension part extending outwardly from the body part; a front body including a through hole into which the body part is inserted, and a placing part on the top of which the extension part is disposed; and an adhesive disposed between the extension part and the placing part, wherein a concave-convex part may be formed on the placing part. The present invention has an effect of enhancing adhesive force between the lens barrel and the front body, thereby maintaining airtightness of an inner space and improving reliability and stability.

The present invention relates to a camera module, comprising: a lens barrel including a body part, and an extension part extending outwardly from the body part; a front body including a through hole into which the body part is inserted, and a placing part on the top of which the extension part is disposed; and an adhesive disposed between the extension part and the placing part, wherein a concave-convex part may be formed on the placing part. The present invention has an effect of enhancing adhesive force between the lens barrel and the front body, thereby maintaining airtightness of an inner space and improving reliability and stability.

The present disclosure relates to encapsulant compositions for use with hard disk drive devices.

The present disclosure relates to encapsulant compositions for use with hard disk drive devices.