The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.

The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.

A water-based temporary fixing adhesive having excellent temporary fixing performance, coating performance and adhesion-stain prevention performance and containing (A) a hydroxy group-having thermoplastic resin and (B) a glucide, wherein the glucide (B) is at least one selected from sugars and sugar alcohols; and a method for producing a member or a part including a temporary fixing step of temporarily fixing a precursor of a member or a part and a processing substrate using the adhesive, and a processing step of mechanically processing the precursor to form a member or a part.

A water-based temporary fixing adhesive having excellent temporary fixing performance, coating performance and adhesion-stain prevention performance and containing (A) a hydroxy group-having thermoplastic resin and (B) a glucide, wherein the glucide (B) is at least one selected from sugars and sugar alcohols; and a method for producing a member or a part including a temporary fixing step of temporarily fixing a precursor of a member or a part and a processing substrate using the adhesive, and a processing step of mechanically processing the precursor to form a member or a part.

A water-based temporary fixing adhesive having excellent temporary fixing performance, coating performance and adhesion-stain prevention performance and containing (A) a hydroxy group-having thermoplastic resin and (B) a glucide, wherein the glucide (B) is at least one selected from sugars and sugar alcohols; and a method for producing a member or a part including a temporary fixing step of temporarily fixing a precursor of a member or a part and a processing substrate using the adhesive, and a processing step of mechanically processing the precursor to form a member or a part.

Methods of using a curable composition, the curable composition including at least one polyether having blocked hydroxyl groups as the plasticizer on at least one alkaline substrate. The curable composition is storage-stable, easy to handle and highly elastic after curing, and does not show any tendency to separate or migrate. It enables elastic bonding, sealing or coating of alkaline substrates, such as, in particular, fresh or green concrete or cement mortar, without occurrence of troublesome odors triggered by plasticizer hydrolysis.

Methods of using a curable composition, the curable composition including at least one polyether having blocked hydroxyl groups as the plasticizer on at least one alkaline substrate. The curable composition is storage-stable, easy to handle and highly elastic after curing, and does not show any tendency to separate or migrate. It enables elastic bonding, sealing or coating of alkaline substrates, such as, in particular, fresh or green concrete or cement mortar, without occurrence of troublesome odors triggered by plasticizer hydrolysis.

A polymer blend including an organic polymer with a reactive silicon-containing group which gives cured objects excellent elongation property and stress relaxation, a composition including the polymer blend, a specific filler, and a curing catalyst, a sealant including the composition; and a sealant for tires, are provided. A polymer blend including an organic polymer with a bifunctional reactive silicon-containing group of a specific structure is mixed with polyoxyalkylene (A). Polyoxyalkylene (A) has an average molecular weight of 13,000 or higher and 100,000 or lower, a reactive-silicon-containing-group equivalent Eqa of 0.010 mmol/g or more and 0.29 mmol/g or less, and contains more than one silicon-containing group per molecule and polyoxyalkylene (B). Polyoxyalkylene (B) has an average molecular weight of 3,000 or higher and 25,000 or lower, a reactive-silicon-containing group only at one end, and a reactive-silicon-containing-group equivalent Eqb of 0.03 mmol/g or more and 0.58 mmol/g or less.

A polymer blend including an organic polymer with a reactive silicon-containing group which gives cured objects excellent elongation property and stress relaxation, a composition including the polymer blend, a specific filler, and a curing catalyst, a sealant including the composition; and a sealant for tires, are provided. A polymer blend including an organic polymer with a bifunctional reactive silicon-containing group of a specific structure is mixed with polyoxyalkylene (A). Polyoxyalkylene (A) has an average molecular weight of 13,000 or higher and 100,000 or lower, a reactive-silicon-containing-group equivalent Eqa of 0.010 mmol/g or more and 0.29 mmol/g or less, and contains more than one silicon-containing group per molecule and polyoxyalkylene (B). Polyoxyalkylene (B) has an average molecular weight of 3,000 or higher and 25,000 or lower, a reactive-silicon-containing group only at one end, and a reactive-silicon-containing-group equivalent Eqb of 0.03 mmol/g or more and 0.58 mmol/g or less.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.