A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends without there being an optical fiber present in the ferrule bore.

A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends without there being an optical fiber present in the ferrule bore.

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A),

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(wherein X is a C.sub.1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C.sub.1-16 hydrocarbon group, Z is a divalent C.sub.1-4 linking group, the divalent linking group being bonded to an O group in formula (1), and R.sup.1 is a hydrogen atom or a methyl group.)

A device wafer is bonded to a handle by a low temperature adhesive bond material that includes a suspended polymer with glass transition temperature greater than room temperature and a diluent polymer that is curable to provide a thermoset polymer upon exposure to ultraviolet radiation, x-ray radiation and/or thermal treatments at low temperature. The suspended polymer and the diluent polymer are mixed to a consistency such that before curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength less than 10 Newtons per square centimeter (N/cm.sup.2), and after curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength not less than about 40 N/cm.sup.2.

A device wafer is bonded to a handle by a low temperature adhesive bond material that includes a suspended polymer with glass transition temperature greater than room temperature and a diluent polymer that is curable to provide a thermoset polymer upon exposure to ultraviolet radiation, x-ray radiation and/or thermal treatments at low temperature. The suspended polymer and the diluent polymer are mixed to a consistency such that before curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength less than 10 Newtons per square centimeter (N/cm.sup.2), and after curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength not less than about 40 N/cm.sup.2.

The present invention is intended to provide a machine component composed of metal and rubber that results in no increase of material costs for an adhesive or increase of manufacturing costs for metal molding, causes no contamination of the metal mold or generates no foreign matter on the metal mold due to adhesion of the adhesive at the time of molding, causes no failure by separation of the adhesive from a fitting portion at the time of fitting the metal component, and is clean and favorable in appearance. A machine component 1 composed of metal and rubber is formed by applying a thermoset resin adhesive A to a surface of a metal component 2 of a predetermined shape, and vulcanizing and adhering a rubber 3 of a predetermined shape to part of the surface of the metal component 2 by metal molding.

The present invention is intended to provide a machine component composed of metal and rubber that results in no increase of material costs for an adhesive or increase of manufacturing costs for metal molding, causes no contamination of the metal mold or generates no foreign matter on the metal mold due to adhesion of the adhesive at the time of molding, causes no failure by separation of the adhesive from a fitting portion at the time of fitting the metal component, and is clean and favorable in appearance. A machine component 1 composed of metal and rubber is formed by applying a thermoset resin adhesive A to a surface of a metal component 2 of a predetermined shape, and vulcanizing and adhering a rubber 3 of a predetermined shape to part of the surface of the metal component 2 by metal molding.

A method of making a fiber optic connector sub-assembly involves: initially disposing a bonding agent in a ferrule bore of a ferrule; heating at least a portion of the ferrule above a melting temperature of the bonding agent so that some of the bonding agent melts; and solidifying the bonding agent that has melted to form the fiber optic connector sub-assembly, all without an optical fiber being disposed within the ferrule bore.

A method of making a fiber optic connector sub-assembly involves: initially disposing a bonding agent in a ferrule bore of a ferrule; heating at least a portion of the ferrule above a melting temperature of the bonding agent so that some of the bonding agent melts; and solidifying the bonding agent that has melted to form the fiber optic connector sub-assembly, all without an optical fiber being disposed within the ferrule bore.

Described herein are poly(aryl ether) (PAE) adhesive compositions including at least one PAE chelating agent. The PAE chelating agent is a PAE polymer. In some embodiments, the PAE adhesive composition can optionally include one or more poly(aryl ether ketone) polymers distinct from the PAE chelating agent. The PAE adhesive composition can be incorporated into polymer-metal junctions to improve the strength thereof. In some such embodiments, the adhesive composition can be disposed between a portion of the plastic component and a portion of the metal component of the polymer-metal junction. In some embodiments, the PAE adhesive compositions can be used in conjunction with one or more adhesion promoters distinct from the PAE adhesive composition. In some embodiments, polymer-metal junctions including the PAE chelating agent can be desirably incorporated in mobile electronic device components.