Provided herein are adhesive compositions comprising a polyurea-poly(meth)acrylate interpenetrating polymer network. Further provided are two-part curable adhesive compositions comprising a Part A initiator composition and a Part B activator composition. The Part A initiator composition comprises an organoborane-amine complex and the Part B activator composition comprises an isocyanate that is reactive with the amine portion of the organoborane-amine complex to liberate organoborane from the organoborane-amine complex. Further provided are methods of using an adhesive composition comprising a polyurea-poly(meth)acrylate interpenetrating polymer network, such as, for example, in joining and/or bonding together polyolefin materials (e.g., polypropylene random copolymer (PP-R) pipes).

Methods of forming laminating adhesive articles include providing a multi-layer article, and a tool with a structured surface. The multi-layer articles include a substrate, an adhesive layer, and a liner or may just include an adhesive layer and a liner. The multi-layer article is placed between the structured surface of the tool and a support surface and the tool is embossed against the liner by applying pressure or a combination of pressure and heat. The embossing causes the structures on the surface of the tool to distort the liner and the adhesive layer but does not distort the substrate. The distortion in the liner is retained upon release of the applied pressure. Upon removal of the liner from the adhesive layer, the structures on the adhesive layer are unstable, but do not immediately collapse.

Methods of forming laminating adhesive articles include providing a multi-layer article, and a tool with a structured surface. The multi-layer articles include a substrate, an adhesive layer, and a liner or may just include an adhesive layer and a liner. The multi-layer article is placed between the structured surface of the tool and a support surface and the tool is embossed against the liner by applying pressure or a combination of pressure and heat. The embossing causes the structures on the surface of the tool to distort the liner and the adhesive layer but does not distort the substrate. The distortion in the liner is retained upon release of the applied pressure. Upon removal of the liner from the adhesive layer, the structures on the adhesive layer are unstable, but do not immediately collapse.

Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C.sub.8-18 alkylene chain and has a melting point from 160 to 250? C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.

Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C.sub.8-18 alkylene chain and has a melting point from 160 to 250? C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.

A binder composition for manufacturing a wood-based material, in particular a board-shaped wood-based material, a method for manufacturing such a wood-based material, and such a wood-based material. In order to provide a binder composition and a method for manufacturing such a wood-based material as well as such a wood-based material, in which the speed of curing of isocyanate binders can be controlled in a targeted manner and, in particular, accelerated, whereby the curing temperature can be lowered on the one hand and, on the other hand, can be kept within a predetermined temperature interval, so that a start of curing can be controlled whereby a safe, fast and cost-effective manufacturing process is made possible without a reduction in product quality, it is provided that the binder composition according to the invention for manufacturing a wood-based material has an organic phase having at least one isocyanate binder, an aqueous phase and also a phase transfer catalyst for accelerating the curing of the isocyanate binder.

The present invention relates to a method for bonding substrates of the same or different type using two-component structural adhesives on the basis of aliphatic polyisocyanates and polyaspartic acid esters, and to a two-component structural adhesive, which contains said two components and has a high strength when hardened.

The present invention relates to a method for bonding substrates of the same or different type using two-component structural adhesives on the basis of aliphatic polyisocyanates and polyaspartic acid esters, and to a two-component structural adhesive, which contains said two components and has a high strength when hardened.

The invention relates provides synthetic medical adhesives which exploit plant derivatives to form covalent bonds with amines and thiols on tissue surfaces.

The invention relates provides synthetic medical adhesives which exploit plant derivatives to form covalent bonds with amines and thiols on tissue surfaces.