C09J175/02

Polyurea composition

The invention relates to compositions comprising at least one first and one second component; the first component K1 comprising at least one di(aminobenzoate) ester A1 of formula (I) with an average molecular weight of 500 g/mol to 2000 g/mol, preferably 600 g/mol to 1500 g/mol and particularly preferred between 650 g/mol and 1300 g/mol, G being a divalent group derived from poly(tetramethylene oxide) diol, and the second component K2 comprising at least one aromatic polyisocyanate B1 with an average molecular weight of 160 g/mol to 1100 g/mol, preferably 500 g/mol to 800 g/mol.

Polyurea composition

The invention relates to compositions comprising at least one first and one second component; the first component K1 comprising at least one di(aminobenzoate) ester A1 of formula (I) with an average molecular weight of 500 g/mol to 2000 g/mol, preferably 600 g/mol to 1500 g/mol and particularly preferred between 650 g/mol and 1300 g/mol, G being a divalent group derived from poly(tetramethylene oxide) diol, and the second component K2 comprising at least one aromatic polyisocyanate B1 with an average molecular weight of 160 g/mol to 1100 g/mol, preferably 500 g/mol to 800 g/mol.

AQUEOUS POLYURETHANE-UREA DISPERSION

The present invention relates to an aqueous dispersion based on polyurethane-urea, a composition comprising the same, and a use of the same in a coating agent, a sealant and an adhesive. The aqueous polyurethane-urea dispersion comprises a polyurethane-urea dispersed therein having sulfonate and/or carboxylate groups and lateral carboxyl groups, wherein the amount of said sulfonate and or carboxylate groups is 1.5 to 15 mmol/100 g; said lateral carboxyl is introduced by an aminocarboxylic acid having an amino functionality of greater than 1; the amount of said lateral carboxyl is 1.5 to 9.5 mmol/100 g, based on the polyurethane-urea solid components. Compared with the prior art, the composition of the polyurethane-urea based aqueous dispersion and a carboxyl reactive cross-linking agent provided by the present invention has a good cross-linking property and an excellent heat-resistance, which is not prone to come unglued when being exposed to heat.

AQUEOUS POLYURETHANE-UREA DISPERSION

The present invention relates to an aqueous dispersion based on polyurethane-urea, a composition comprising the same, and a use of the same in a coating agent, a sealant and an adhesive. The aqueous polyurethane-urea dispersion comprises a polyurethane-urea dispersed therein having sulfonate and/or carboxylate groups and lateral carboxyl groups, wherein the amount of said sulfonate and or carboxylate groups is 1.5 to 15 mmol/100 g; said lateral carboxyl is introduced by an aminocarboxylic acid having an amino functionality of greater than 1; the amount of said lateral carboxyl is 1.5 to 9.5 mmol/100 g, based on the polyurethane-urea solid components. Compared with the prior art, the composition of the polyurethane-urea based aqueous dispersion and a carboxyl reactive cross-linking agent provided by the present invention has a good cross-linking property and an excellent heat-resistance, which is not prone to come unglued when being exposed to heat.

ADHESIVES FOR CHEMICAL MECHANICAL PLANARIZATION APPLICATIONS
20180362810 · 2018-12-20 ·

Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.

ADHESIVES FOR CHEMICAL MECHANICAL PLANARIZATION APPLICATIONS
20180362810 · 2018-12-20 ·

Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.

Adhesive composition, laminate and optical article comprising the laminate

To provide an adhesive composition capable of firmly bonding polymer sheets together, comprising: (I) 100 parts by mass of an end-unreactive urethane urea resin; and (III) 4.0 to 20 parts by mass of a polyisocyanate compound having at least two isocyanate groups in the molecule, wherein the polyisocyanate compound (III) contains (IIIA) a polyisocyanate compound having an isocyanate group bonded to secondary carbon and (IIIB) a polyisocyanate compound having 4 to 30 carbon atoms in the molecule other than the component (IIIA), and the amount of the component (IIIB) is 10 to 500 parts by mass based on 100 parts by mass of the component (IIIA).

Adhesive composition, laminate and optical article comprising the laminate

To provide an adhesive composition capable of firmly bonding polymer sheets together, comprising: (I) 100 parts by mass of an end-unreactive urethane urea resin; and (III) 4.0 to 20 parts by mass of a polyisocyanate compound having at least two isocyanate groups in the molecule, wherein the polyisocyanate compound (III) contains (IIIA) a polyisocyanate compound having an isocyanate group bonded to secondary carbon and (IIIB) a polyisocyanate compound having 4 to 30 carbon atoms in the molecule other than the component (IIIA), and the amount of the component (IIIB) is 10 to 500 parts by mass based on 100 parts by mass of the component (IIIA).

TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION
20240271023 · 2024-08-15 ·

Provided herein is a two-component polyurethane adhesive composition.

Electrical Debonding of PU Hot Melt Adhesives By Use of Conductive Inks

The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained.