Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T.sub.m) from about 90 to about 150 C., in particular from about 100 C. to about 125 C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof, for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

A method of producing a joined body includes: providing a composition for transient liquid phase sintering to at least one of a portion of a first member to which a second member is to be joined and a portion of the second member to which the first member is to be joined, so as to form a composition layer; bringing the portion of the first member to which the second member is to be joined and the portion of the second member to which the first member is to be joined into contact with each other via the composition layer; and sintering the composition layer by heating, and the composition for transient liquid phase sintering includes metal particles capable of transient liquid phase sintering and a thermoplastic resin.

A method of producing a joined body includes: providing a composition for transient liquid phase sintering to at least one of a portion of a first member to which a second member is to be joined and a portion of the second member to which the first member is to be joined, so as to form a composition layer; bringing the portion of the first member to which the second member is to be joined and the portion of the second member to which the first member is to be joined into contact with each other via the composition layer; and sintering the composition layer by heating, and the composition for transient liquid phase sintering includes metal particles capable of transient liquid phase sintering and a thermoplastic resin.

Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T.sub.m) from about 90 to about 150 C., in particular from about 100 C. to about 125 C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof,
for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T.sub.m) from about 90 to about 150 C., in particular from about 100 C. to about 125 C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof,
for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

The present invention relates to a binder composition comprising a) component A comprising polymer(s) A1 having primary and/or secondary amino groups, wherein polymer(s) A1 has(have) a primary and secondary amine group nitrogen content of at least 1 wt.-% and b) component B comprising component B1 which is 1,3-dihydroxyacetone, glycolaldehyde, glyceraldehyde or any mixture thereof, wherein the polymer(s) A1 has(have) a total weight average molecular weight M.sub.w,total of at least 800 g/mol.

The present invention relates to a binder composition comprising a) component A comprising polymer(s) A1 having primary and/or secondary amino groups, wherein polymer(s) A1 has(have) a primary and secondary amine group nitrogen content of at least 1 wt.-% and b) component B comprising component B1 which is 1,3-dihydroxyacetone, glycolaldehyde, glyceraldehyde or any mixture thereof, wherein the polymer(s) A1 has(have) a total weight average molecular weight M.sub.w,total of at least 800 g/mol.