Provided is an adhesive composition including lysine, alpha ketoglutaric acid, and water, wherein the lysine and the alpha ketoglutaric acid are present in the form of an aqueous salt solution and do not form precipitates in the aqueous solution.

Provided is an adhesive composition including lysine, alpha ketoglutaric acid, and water, wherein the lysine and the alpha ketoglutaric acid are present in the form of an aqueous salt solution and do not form precipitates in the aqueous solution.

Provided are a breathable waterproof membrane capable of being thermally-bonded to a fabric by using a hot melt adhesive that is dot-coated on the surface thereof, and a method of manufacturing the same. In particular, the present invention relates to a breathable waterproof membrane capable of being thermally-bonded to a fabric and a method of manufacturing the same, the membrane being applied to the manufacture of outdoor clothing, thereby giving excellent breathability and waterproof properties to the outdoor clothing and simplifying a manufacturing process of the outdoor clothing.

Provided are a breathable waterproof membrane capable of being thermally-bonded to a fabric by using a hot melt adhesive that is dot-coated on the surface thereof, and a method of manufacturing the same. In particular, the present invention relates to a breathable waterproof membrane capable of being thermally-bonded to a fabric and a method of manufacturing the same, the membrane being applied to the manufacture of outdoor clothing, thereby giving excellent breathability and waterproof properties to the outdoor clothing and simplifying a manufacturing process of the outdoor clothing.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

Low primary amine (LPA) polyaspartic esters are provided which comprise a reaction product of an aliphatic diamine and an excess of a Michael addition receptor optionally, in the presence of a C.sub.1-C.sub.10 alcohol, wherein the low primary amine (LPA) polyaspartic ester has a monoaspartate content of less than 10%. The low primary amine (LPA) polyaspartic esters of the invention may find use in slow reactivity polyurea systems and react with polyisocyanates to produce polyurea coatings, adhesives, sealants, films, composites, castings, and paints.