Low primary amine (LPA) polyaspartic esters are provided which comprise a reaction product of an aliphatic diamine and an excess of a Michael addition receptor optionally, in the presence of a C.sub.1-C.sub.10 alcohol, wherein the low primary amine (LPA) polyaspartic ester has a monoaspartate content of less than 10%. The low primary amine (LPA) polyaspartic esters of the invention may find use in slow reactivity polyurea systems and react with polyisocyanates to produce polyurea coatings, adhesives, sealants, films, composites, castings, and paints.

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

A novel hot-melt adhesive and a preparation method thereof are disclosed, and in particular a hot-melt adhesive for bonding aluminum, stainless steel or other metal materials and PVC plastics is disclosed. The specific nylon-type copolyamide is firstly prepared by designing specific raw materials and percentage thereof, and in combination with favorable bonding properties of the nylon-type copolyamide for metals and favorable bonding characteristics of the perchloroethylene resin for PVC, a double screw extruder is utilized to perform sufficient melt blending on the nylon-type copolyamide and the perchloroethylene resin under the synergistic actions of related aids, so that the obtained novel hot-melt adhesive has favorable bonding properties for both metals and PVC.

A novel hot-melt adhesive and a preparation method thereof are disclosed, and in particular a hot-melt adhesive for bonding aluminum, stainless steel or other metal materials and PVC plastics is disclosed. The specific nylon-type copolyamide is firstly prepared by designing specific raw materials and percentage thereof, and in combination with favorable bonding properties of the nylon-type copolyamide for metals and favorable bonding characteristics of the perchloroethylene resin for PVC, a double screw extruder is utilized to perform sufficient melt blending on the nylon-type copolyamide and the perchloroethylene resin under the synergistic actions of related aids, so that the obtained novel hot-melt adhesive has favorable bonding properties for both metals and PVC.

A novel hot-melt adhesive and a preparation method thereof are disclosed, and in particular a hot-melt adhesive for bonding aluminum, stainless steel or other metal materials and PVC plastics is disclosed. The specific nylon-type copolyamide is firstly prepared by designing specific raw materials and percentage thereof, and in combination with favorable bonding properties of the nylon-type copolyamide for metals and favorable bonding characteristics of the perchloroethylene resin for PVC, a double screw extruder is utilized to perform sufficient melt blending on the nylon-type copolyamide and the perchloroethylene resin under the synergistic actions of related aids, so that the obtained novel hot-melt adhesive has favorable bonding properties for both metals and PVC.

A polyamide resin composition includes: about 5% by weight (wt %) to about 50 wt % of an aromatic polyamide resin; about 10 wt % to about 60 wt % of an aliphatic polyamide resin; about 20 wt % to about 60 wt % of inorganic fillers; and about 0.5 wt % to about 5 wt % of a polyetheresteramide block copolymer, wherein the polyetheresteramide block copolymer is a polymer of a reaction mixture including about 5 wt % to about 95 wt % of an amino carboxylic acid, lactam or diamine-dicarboxylic acid salt and about 5 wt % to about 95 wt % of polyalkylene glycol. The polyamide resin composition can exhibit good adhesion with respect to other materials and anti-contamination (antifouling) properties.

A polyamide resin composition includes: about 5% by weight (wt %) to about 50 wt % of an aromatic polyamide resin; about 10 wt % to about 60 wt % of an aliphatic polyamide resin; about 20 wt % to about 60 wt % of inorganic fillers; and about 0.5 wt % to about 5 wt % of a polyetheresteramide block copolymer, wherein the polyetheresteramide block copolymer is a polymer of a reaction mixture including about 5 wt % to about 95 wt % of an amino carboxylic acid, lactam or diamine-dicarboxylic acid salt and about 5 wt % to about 95 wt % of polyalkylene glycol. The polyamide resin composition can exhibit good adhesion with respect to other materials and anti-contamination (antifouling) properties.

Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives;
where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.