Disclosed is a photocurable composition containing a dithiol compound having a disulfide bond, a compound having two ethylenically unsaturated groups, a hydrogen abstraction type photoradical generator, and an intramolecular cleavage type photoradical generator.

An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds. ##STR00001##

An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

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The present invention provides a polyarylene sulfide resin composition comprising a mixture of polyarylene sulfide and a binder resin having excellent electrical conductivity and high temperature stability.

An electrically conductive material includes an anionic polymer having a polymer backbone that is bonded to a plurality of terminal catechol moieties and a plurality of terminal sulfonate moieties. It also includes a cationic polymer including poly(3,4-ethylenedioxythiophene).

An electrically conductive material includes an anionic polymer having a polymer backbone that is bonded to a plurality of terminal catechol moieties and a plurality of terminal sulfonate moieties. It also includes a cationic polymer including poly(3,4-ethylenedioxythiophene).

Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.

Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.

A bonding process is described in which two substrates are bonded together by applying to the surface of at least one of the substrates a curable, not yet cured 2-component adhesive that comprises, in a first component, a compound A having at least one defined cyclic thiocarbonate unit having a five-membered ring structure and, in a second component, a curing compound B selected from compounds having at least one functional group selected from primary amine groups and secondary amine groups.

A dual curable thiol-ene composition comprising a polythiol, an unsaturated compound, a photoinitiator, an organic hydroperoxide (thermal initiator) and optionally a nitrogen-containing base, such as e.g. an N-heterocyclic compound (together with the organic hydroperoxide a redox initiator system). A cross-linked polymer prepared therefrom. A method of making such a polymer. A cured sealant comprising such a polymer. The sealant is preferably for use in aerospace.