Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25° C. and free of solvent: (A) silicone-modified polyimide resin; (B) polymerizable compound; (C) polymerization initiator, (D) hydrophobic fumed silica; and (E) adhesion auxiliary agent.

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface, wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer including a dry adhesive fiber structure having a plurality of pillar structures.

A method of producing wood-base panels, especially OSB wood-base panels is provided. The method including the steps of providing wood strands, applying at least one adhesive system to the wood strands having at least one polymer adhesive and at least one nanoparticle below 500 nm, and pressing the wood strands admixed with the adhesive system to form wood-base panels.

A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an —Si—O—Si— backbone. The organosiloxane block copolymer comprises at least two blocks that are phase-separated. The organosiloxane block copolymer has at least a first glass transition temperature (Tg.sup.1) and a second glass transition temperature (Tg.sup.2), the second glass transition temperature being at 25° C. or higher. A 1 mm thick cast film of the adhesive composition has, in some embodiments, a light transmittance of at least 95%. The adhesive composition of the various embodiments of the present invention can be B-staged at about Tg.sup.2 or at about 100° C. below Tg.sup.2.

Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an —Si—O—Si— backbone. The organosiloxane block copolymer comprises at least two blocks that are phase-separated. The organosiloxane block copolymer has at least a first glass transition temperature (Tg.sup.1) and a second glass transition temperature (Tg.sup.2), the second glass transition temperature being at 25° C. or higher. A 1 mm thick cast film of the adhesive composition has, in some embodiments, a light transmittance of at least 95%. The adhesive composition of the various embodiments of the present invention can be B-staged at about Tg.sup.2 or at about 100° C. below Tg.sup.2.

Compositions of matter that have adhesion properties. The presence of a large number of silanols on the molecules described herein creates a solubility or disperseability of these molecules in aqueous solutions that is not obtainable from random hydrolysis of the precursor silanes.