The present disclosure provides 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate. The adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, and (b) mercapto-crosslinker. The adhesive composition is cured by UVNis/LED or thermal or combined and is cured faster requiring lower energy. The present disclosure also provides assemblies including such an adhesive and methods of using the adhesives.

The present invention relates to alkoxyalkylsilane-modified polysiloxanes, to processes for the production thereof, and to the use thereof.

The present invention relates to alkoxyalkylsilane-modified polysiloxanes, to processes for the production thereof, and to the use thereof.

There is provided herein a silicone pressure sensitive adhesive composition comprising (A) a linear olefinically-functional polyorganosiloxane copolymer gum possessing a degree of polymerization in excess of 3,000; (B) a silicone resin including at least one M.sup.H unit and at least one Q unit; and, (C) a hydrosilylation catalyst, wherein the composition is in the substantial absence of low molecular weight siloxane having a degree of polymerization of less than 3,000 and wherein the composition has low peel adhesion to and clean removal from a substrate. There is also provided a protective film including the same as well as a method of making the protective film.

There is provided herein a silicone pressure sensitive adhesive composition comprising (A) a linear olefinically-functional polyorganosiloxane copolymer gum possessing a degree of polymerization in excess of 3,000; (B) a silicone resin including at least one M.sup.H unit and at least one Q unit; and, (C) a hydrosilylation catalyst, wherein the composition is in the substantial absence of low molecular weight siloxane having a degree of polymerization of less than 3,000 and wherein the composition has low peel adhesion to and clean removal from a substrate. There is also provided a protective film including the same as well as a method of making the protective film.

A silicone pressure sensitive adhesive with amphiphilic copolymers for maintaining adhesion in a moist environment. The amphiphilic copolymers for silicone adhesives include at least one silicone moiety and at least one hydrophilic segment. Such adhesives are applicable to securing medical devices to human skin.

A pressure sensitive adhesive film comprises a substrate film and a pressure sensitive adhesive (PSA) layer formed on a surface of the substrate film. The PSA layer is formed from a silicone composition comprising: a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 10,000 to 1,000,000 mPa.Math.s; (B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25° C. or having a viscosity at 25° C. of more than 1,000,000 mPa.Math.s; (C) an organopolysiloxane resin represented by the following average unit formula: (R.sup.1.sub.3SiO.sub.1/2).sub.x(SiO.sub.4/2).sub.1.0, wherein each R.sup.1 represents a halogen-substituted or unsubstituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0; (D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (E) silica fine powder; and (F) a hydrosilylation catalyst.

Polyorganosiloxanes and methods for their preparation are disclosed. The polyorganosiloxanes are useful in curable compositions. The polyorganosiloxanes may have up to 9 silicon bonded hydrogen atoms, or other curable groups, per molecule.

Polyorganosiloxanes and methods for their preparation are disclosed. The polyorganosiloxanes are useful in curable compositions. The polyorganosiloxanes may have up to 9 silicon bonded hydrogen atoms, or other curable groups, per molecule.

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.