The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I): ##STR00001##
as described herein. There is provided a method of making the polysiloxane. In addition there is provided a curable composition including the polysiloxane.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I): ##STR00001##
as described herein. There is provided a method of making the polysiloxane. In addition there is provided a curable composition including the polysiloxane.

There is provided a layered body including a resin layer and a second layer that are stacked on one another. The resin layer is formed of a resin composition containing a fine inorganic particle composite that includes: a composite resin in which a polysiloxane segment having a structural unit represented by general formula and/or general formula and further having a silanol group and/or a hydrolyzable silyl group is bonded to a vinyl-based polymer segment through a bond represented by general formula; and fine inorganic particles that are each bonded to the composite resin at the polysiloxane segment through a siloxane bond.

There is provided a layered body including a resin layer and a second layer that are stacked on one another. The resin layer is formed of a resin composition containing a fine inorganic particle composite that includes: a composite resin in which a polysiloxane segment having a structural unit represented by general formula and/or general formula and further having a silanol group and/or a hydrolyzable silyl group is bonded to a vinyl-based polymer segment through a bond represented by general formula; and fine inorganic particles that are each bonded to the composite resin at the polysiloxane segment through a siloxane bond.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst.

The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.