A radiation curable article includes a silicone composition including a silicone oligomer and a photoactive catalyst, wherein the silicone oligomer comprises at least one alkenyl group and at least one hydride group, the radiation curable silicone oligomer having a viscosity of less than about 100,000 centipoise prior to cure. Further included is a method of forming a radiation curable article includes providing a silicone composition including a silicone oligomer and a photoactive catalyst, wherein the silicone oligomer includes at least one alkenyl group and at least one hydride group, the silicone oligomer having a viscosity of less than about 100,000 centipoise prior to cure; and irradiating the silicone composition with a radiation source.

An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, wherein the adhesive composition contains an adhesive component and carbon black, and the adhesive component contains a component (A) which is cured through hydrosilylation.

An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, wherein the adhesive composition contains an adhesive component and carbon black, and the adhesive component contains a component (A) which is cured through hydrosilylation.

A manner for improving storage stability of a curable resin composition and close adhesion of a cured product to a polycarbonate. The present description relates to a curable resin composition including the following components (A) to (C): component (A): an isocyanate group-containing urethane prepolymer, component (B): a powder of a polyamine compound which is solid at 25° C., and component (C): at least one selected from the group consisting of a monofunctional (meth)acrylate compound having an alicyclic structure or a monofunctional (meth)acrylate compound having an aromatic ring, a monofunctional (meth)acrylate compound having a hydrolyzable silyl group, and a polyfunctional (meth)acrylate compound, where the composition does not substantially include a photoradical initiator.

A manner for improving storage stability of a curable resin composition and close adhesion of a cured product to a polycarbonate. The present description relates to a curable resin composition including the following components (A) to (C): component (A): an isocyanate group-containing urethane prepolymer, component (B): a powder of a polyamine compound which is solid at 25° C., and component (C): at least one selected from the group consisting of a monofunctional (meth)acrylate compound having an alicyclic structure or a monofunctional (meth)acrylate compound having an aromatic ring, a monofunctional (meth)acrylate compound having a hydrolyzable silyl group, and a polyfunctional (meth)acrylate compound, where the composition does not substantially include a photoradical initiator.

A condensation-curable electrically conductive silicone adhesive composition, methods of making and using same, and manufactured articles and devices comprising or prepared from the same.

A condensation-curable electrically conductive silicone adhesive composition, methods of making and using same, and manufactured articles and devices comprising or prepared from the same.

A condensation-curable electrically conductive silicone adhesive composition, methods of making and using same, and manufactured articles and devices comprising or prepared from the same.

A display device includes: a display panel configured to display an image; a window panel covering the display panel, and including a display area configured to transmit the image and a non-display area surrounding the display area; and an adhesive layer between the display panel and the window panel, wherein the window panel includes: a window substrate facing the display panel; a protective layer on a portion of a surface of the window substrate in the non-display area; and a light blocking layer on the protective layer, wherein the protective layer is an organic-inorganic composite layer.

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.