A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

This organic silicon compound is characterized by being represented by structural formula (1), and has good reactivity while having a monoalkoxysilyl group.

##STR00001##

(In the formula, X represents a monovalent to trivalent organic group including a polyoxyalkylene structure, an alkylene group having 1-20 carbon atoms, O, S, N, or the like, R.sup.1 and R.sup.2 each independently represent an alkyl group or the like having 1-10 carbon atoms, Y represents a single bond, O, S, or the like, A.sup.1, A.sup.2, A.sup.3, A.sup.4, and A.sup.5 each represent a single bond, or a divalent linking group such as a divalent hydrocarbon group having 1-20 carbon atoms, and n represents a number of 1-3.)

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.

Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.

Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.

An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.