A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

Provided are a pressure-sensitive adhesive composition, a protection film, an optical laminate, a polarizing plate, and a display device. Provided is the pressure-sensitive adhesive composition which is excellent in various physical properties, such as endurance reliability, has excellent antistatic characteristics that change little over time. The pressure-sensitive adhesive composition can be used for a protection film, or can be used for an optical film, such as a polarizing plate, for example.

Provided are a pressure-sensitive adhesive composition, a protection film, an optical laminate, a polarizing plate, and a display device. Provided is the pressure-sensitive adhesive composition which is excellent in various physical properties, such as endurance reliability, has excellent antistatic characteristics that change little over time. The pressure-sensitive adhesive composition can be used for a protection film, or can be used for an optical film, such as a polarizing plate, for example.

Provided are a pressure-sensitive adhesive tape, a method of manufacturing the same, and an electronic device having the same. The pressure-sensitive adhesive tape includes: a fiber accumulation type substrate in which a plurality of fibers are accumulated to form a plurality of pores therebetween; a metal coating layer coated on the outer circumferential surfaces of the plurality of fibers of the fiber accumulation type substrate; and an electrically conductive adhesive layer formed on one side or both sides of the fiber accumulation type substrate on which the metal coating layer is formed, wherein the electrically conductive adhesive layer is formed of an electrically conductive adhesive material filled in the plurality of pores and is electrically connected by an applied pressure.

Provided are a pressure-sensitive adhesive tape, a method of manufacturing the same, and an electronic device having the same. The pressure-sensitive adhesive tape includes: a fiber accumulation type substrate in which a plurality of fibers are accumulated to form a plurality of pores therebetween; a metal coating layer coated on the outer circumferential surfaces of the plurality of fibers of the fiber accumulation type substrate; and an electrically conductive adhesive layer formed on one side or both sides of the fiber accumulation type substrate on which the metal coating layer is formed, wherein the electrically conductive adhesive layer is formed of an electrically conductive adhesive material filled in the plurality of pores and is electrically connected by an applied pressure.

An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.

An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.

Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (μm) of the intermediate layer, a thickness C (μm) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D≥20 (MPa.Math.N).