Patent classifications
C09J2203/326
BLOCK COPOLYMER, RESIN COMPOSITION, STRETCH CONDUCTOR, ELECTRONIC DEVICE, AND PRESSURE-SENSITIVE ADHESIVE FILM
A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.
ADHESIVE AGENT COMPOSITION, ADHESIVE TAPE, AFFIXING METHOD FOR ELECTRONIC DEVICE COMPONENT OR IN-VEHICLE COMPONENT, AND PRODUCTION METHOD FOR ELECTRONIC DEVICE COMPONENT OR IN-VEHICLE COMPONENT
The present invention aims to provide an adhesive composition that can exhibit excellent adhesion to both smooth surfaces and rough surfaces. The present invention also aims to provide an adhesive tape including an adhesive layer containing the adhesive composition, as well as a method for fixing and a method for producing an electronic device component or an in-vehicle component using the adhesive tape. Provided is an adhesive composition containing an acrylic copolymer containing a structural unit derived from n-heptyl (meth)acrylate.
APPARATUS FOR SEPARATING SEMICONDUCTOR CHIP AND METHOD FOR SEPARATING SEMICONDUCTOR BY USING SAME
Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.
Low-water-vapor-permeability polyolefin-elastomer film and method for preparing the same
The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.
Transient infrastructure for ubiquitous network communications applications
The disclosure generally relates to networking infrastructure and, more particularly, to installing transient infrastructure for ubiquitous networking applications. A wireless gateway device is sent to physical premises with a parcel. After the wireless gateway device is delivered to the physical premises, a processor of the wireless gateway device draws power from the energy source to perform operations comprising executing program code stored in non-transitory processor-readable medium to establish a wireless communications connection with a network service through a first type of wireless communications interface. The wireless gateway device performs operations comprising establishing wireless communications with one or more wireless peripheral devices in the physical premises through the second type of wireless communications interface.
SUBSTRATE-CONVEYING SUPPORT TAPE AND ELECTRONIC APPARATUS/DEVICE PRODUCTION METHOD
A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more.
HIGH TEMPERATURE RESISTANT B-STAGEABLE EPOXY ADHESIVE AND ARTICLE MANUFACTURED THEREFROM
The present disclosure relates to a B-stageable epoxy adhesive composition and an article manufactured therefrom. The B-stageable epoxy adhesive composition comprises (A) 20% to 50% by weight of a first epoxy resin with an epoxide equivalent of 5000 g/eq or more; (B) 5% to 20% by weight of a second epoxy resin with an epoxide equivalent of 800 g/eq or less and having 2 to 4 epoxy functional groups; (C) 5% to 30% by weight of a carboxyl terminated polyester; (D) 5% to 15% by weight of a poly-isocyanate modified polyester; and (E) 0.1% to 0.5% by weight of a crosslinking agent containing 2 or more aziridine groups, all the content percentages are based on the total weight of the B-stageable epoxy adhesive composition. The B-stageable epoxy adhesive composition and the related products could be widely used as insulation protection for battery management, bus bar, transformers and other markets with a good balance between a high bonding strength and a high temperature resistance, and others.
ADHESIVE TAPE
The adhesive tape of the present disclosure includes: a substrate; and an adhesive layer disposed on one surface of the substrate. In the adhesive tape of the present disclosure, when a breakdown voltage in a thickness direction of the adhesive tape is represented as X (unit: kV) and an initial elastic modulus evaluated from a stress-strain curve in a tensile test is represented as Y (unit: N/mm), an inequality Y ≤ 4.5X -22.5 is satisfied. The adhesive tape of the present disclosure has an excellent balance between insulating properties and winding properties in winding work.
LIGHT ROUTE CONTROL MEMBER AND DISPLAY DEVICE COMPRISING SAME
A light path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed under the second substrate; a light conversion part disposed between the first electrode and the second electrode; and an adhesive layer disposed between the second electrode and the light conversion part, wherein the light conversion part comprises alternately disposed partition wall portions and accommodating portions, the accommodating portions comprise a dispersion and a plurality of light absorbing particles disposed in the dispersion, and the log volume resistivity of the adhesive layer is 9 Ω.Math.cm to 15 Ω.Math.cm.
ADHESIVE FILM PRODUCTION APPARATUS AND ADHESIVE FILM PRODUCTION METHOD
Provided is an adhesive film production apparatus for producing an adhesive film having an adhesive layer on a base material layer, the adhesive layer having an elastic modulus at 230° C. of 1 MPa or greater and having a glass transition temperature higher than normal temperature, the adhesive film production apparatus including a feeding roller; a cutting part; and a plurality of winding cores, wherein the raw film of the adhesive film is wound on the feeding roller such that the adhesive layer faces outward, and wherein in the conveyance path of the adhesive film traveling from the cutting part toward the winding core, the number of times of the adhesive layer of the adhesive film bending in a convex manner is set to be equal to or more than the number of times of the adhesive layer bending in a concave manner.